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pro vyhledávání: '"Zhou, Guifa"'
Publikováno v:
In Microelectronics Reliability November 2020 114
Publikováno v:
Microelectronics Reliability. 114:113844
Accelerated life test (ALT) is widely used to predict life of solder joints nowadays, and how to shorten the test time and improve the precise of evaluation is one of the most important issues. Based on statistical results of field failure for solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::854e6762a135d9a8e4b8d4b4d498e53c
https://doi.org/10.1016/j.microrel.2020.113844
https://doi.org/10.1016/j.microrel.2020.113844