Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zhongcai Niu"'
Publikováno v:
2022 China Semiconductor Technology International Conference (CSTIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71a04c2ce7c2b60c98c7ab1ec2d83642
https://doi.org/10.1109/cstic55103.2022.9856739
https://doi.org/10.1109/cstic55103.2022.9856739
Autor:
Cheng Xu, Wenqi Zhang, Chongshen Song, Zhongcai Niu, Ui-Hyoung Lee, Jaihyung Won, Jong-yong Bae, Xiangmeng Jing
Publikováno v:
ECS Transactions. 66:183-191
Stacking of ICs using three-dimensional (3D) integration technology helps in significantly reducing wiring lengths, interconnection latency, and power dissipation while enhancing performance. Through silicon vias (TSVs) are regarded as a key enabling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::85fadbce428c5418d635ff5be30916f0
https://doi.org/10.1149/06604.0183ecst
https://doi.org/10.1149/06604.0183ecst
Publikováno v:
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Through silicon via (TSV) based 2.5D and 3D integration technology is regarded as the most promising enabling technology for next generation system integration. One of the concerns associated with TSV is the reliability issue of the TSV based devices
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6206616c2e5b1ce485536b4ab9e09b8
https://doi.org/10.1109/icept.2015.7236655
https://doi.org/10.1109/icept.2015.7236655
Autor:
Fengwei Dai, Yuechen Zhuang, Daquan Yu, Guoping Zhang, Wenqi Zhang, Zhongcai Niu, Zhenzhong Yong
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
This paper studies a creative spray coating process applied to the forming of sidewall insulation of through silicon via (TSV) in CMOS image sensor (CIS) packaging. In this paper, through controlling the nitrogen gas pressure, rate of polymer solutio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b8454571406b386dbee11c388aa924b
https://doi.org/10.1109/eptc.2014.7028410
https://doi.org/10.1109/eptc.2014.7028410
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
TSV CIS package technology is based on a via-last approach in association with an adapted bonding for optical applications. With the gradual increase of the CIS pixel and package integration density, CIS packaging requirements are also increasing. Hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3040fd619fd2b1800843ea4dc5fdb9df
https://doi.org/10.1109/icept.2014.6922686
https://doi.org/10.1109/icept.2014.6922686