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pro vyhledávání: '"Zhong-Yen Yu"'
Autor:
Yun-Fong Lee, Yu-Chen Huang, Jui-Sheng Chang, Ting-Yi Cheng, Po-Yu Chen, Wei-Chieh Huang, Mei-Hsin Lo, Kuan-Lin Fu, Tse-Lin Lai, Po-Kai Chang, Zhong-Yen Yu, Cheng-Yi Liu
Publikováno v:
Royal Society Open Science, Vol 11, Iss 9 (2024)
Fine-grain copper (Cu) films (grain size: 100.36 nm) with a near-atomic-scale surface (0.39 nm) were electroplated. Without advanced post-surface treatment, Cu–Cu direct bonding can be achieved with present-day fine-grain Cu films at 130℃ in air
Externí odkaz:
https://doaj.org/article/d8a16e4e273341e99b79d76575454a59
