Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Zhong-Liang PAN"'
Autor:
Feng DAI1, Zhong-Liang PAN1 panzhongliang@m.scnu.edu.cn
Publikováno v:
Thermal Science. 2023, Vol. 27 Issue 5A, p3551-3559. 9p.
Autor:
Peng XU1, Zhong-Liang PAN1 panzhongliang@m.scnu.edu.cn
Publikováno v:
Thermal Science. 2020, Vol. 24 Issue 3B, p2067-2075. 9p.
Autor:
Zhong-liang Pan, Li-Ping Yao
Publikováno v:
Multimedia Tools and Applications. 80:3425-3442
To the best of our knowledge, currently the physical model based method is still an ill posed problem. Additionally, the image enhancement approaches also suffer from the texture preservation issue. Retinex-based approach is proved its effectiveness
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4dd540fedc19df21f81af32b406a046
https://doi.org/10.1007/s11042-020-09812-7
https://doi.org/10.1007/s11042-020-09812-7
Autor:
Zhong-Liang Pan, Peng Xu
Publikováno v:
Thermal Science, Vol 24, Iss 3 Part B, Pp 2067-2075 (2020)
This paper applies the multi-layer graphene nanoribbon as a new prospective filler material for through silicon via to solve the complex heat problems in the 3-D integrated circuits. An equivalent thermal model for 3-D integrated circuits with the ML
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::04f676f58ad8e96d2db23f4f42808bc1
https://doi.org/10.2298/tsci180507321x
https://doi.org/10.2298/tsci180507321x
Autor:
Feng Dai, Zhong-Liang Pan
Publikováno v:
Thermal Science. :21-21
In the past few years, thermal through silicon via (TTSV) has been experimentally investigated as an effective heat dissipation path. Although a lot of heat dissipation-related issues have been solved in three-dimensional integrated circuit (3D-IC),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::080aec86b4d64b13ae490f6a47e3b9be
https://doi.org/10.2298/tsci220801021d
https://doi.org/10.2298/tsci220801021d
Publikováno v:
Thermal Science, Vol 21, Iss 4, Pp 1601-1606 (2017)
An analytical thermal model is developed for N-die stacked chips with integrated micro-channels cooling. The model is implemented with some mathematical software. Comparison of the temperature predicted by the proposed model with some computer fluid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2502bf8e76298c5a4fc9ee5fb42d91ae
http://www.doiserbia.nb.rs/img/doi/0354-9836/2017/0354-98361700041W.pdf
http://www.doiserbia.nb.rs/img/doi/0354-9836/2017/0354-98361700041W.pdf
Autor:
Zhong-Liang Pan, Li-Ping Yao
Publikováno v:
Physical and engineering sciences in medicine. 44(2)
In recent studies, the physiological parameters derived from human vital signals are found as the status response of the heart and arteries. In this paper, we therefore firstly attempt to extract abundant vital features from photoplethysmography(PPG)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bff795c267dd2e2224a9bd91ff0b88f0
https://pubmed.ncbi.nlm.nih.gov/33738778
https://pubmed.ncbi.nlm.nih.gov/33738778
Autor:
Kang-Jia WANG1, Zhong-Liang PAN1 panscnuu@126.com
Publikováno v:
Thermal Science. 2016, Vol. 20 Issue 3, p899-902. 4p.
Autor:
Zhong-Liang Pan, Kang-Jia Wang
Publikováno v:
Thermal Science, Vol 20, Iss 3, Pp 899-902 (2016)
Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::efcf123f31752b390a4811636b088a52
http://www.doiserbia.nb.rs/img/doi/0354-9836/2016/0354-98361603899W.pdf
http://www.doiserbia.nb.rs/img/doi/0354-9836/2016/0354-98361603899W.pdf
Autor:
Yu-Qiang Cui, Zhong-Liang Pan
Publikováno v:
Modern Physics Letters A. 34:1950003
We investigate the finite-temperature and zero quark chemical potential QCD chiral phase transition of strongly interacting matter within the two-flavor Nambu–Jona-Lasinio (NJL) model as well as the proper time regularization. We use two different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d505cf11262104ce131b06a678241287
https://doi.org/10.1142/s0217732319500032
https://doi.org/10.1142/s0217732319500032