Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Zhong-Jie Hong"'
Autor:
Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen, Mu-Ping Hsu, Han-Wen Hu, Tai-Yu Lin, Ying-Chan Hung, Kuan-Neng Chen
Publikováno v:
IEEE Electron Device Letters. 44:492-495
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3db55874e4728f36da99a76a917edac
https://doi.org/10.1109/led.2023.3239011
https://doi.org/10.1109/led.2023.3239011
Autor:
Ying-Ting Chung, Tsung-Yi Kuo, Kuan-Neng Chen, Tzu-Chieh Chou, Yu-Wei Liu, Demin Liu, Zhong-Jie Hong, Han-Wen Hu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:573-578
Pt has been investigated as a metal passivation material to achieve low-temperature Cu–Cu direct bonding process. With 10-nm Pt passivation layer capping on Cu surface, a good bonding surface with no oxides and small grain size can be obtained. Dur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6c8a639d7390dc3769e986711f56e0d
https://doi.org/10.1109/tcpmt.2021.3069085
https://doi.org/10.1109/tcpmt.2021.3069085
Autor:
Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfd8de8691a4a1bcc1e434bc3fdf078d
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830175
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830175
Autor:
Hao-Tung Chung, Bo-Jheng Shih, Chih-Chao Yang, Nei-Chih Lin, Po-Tsang Huang, Yun-Ping Lan, Kuan-Fu Lai, Wan-Ting Hsu, Yu-Ming Pan, Zhong-Jie Hong, Han-Wen Hu, Huang-Chung Cheng, Chang-Hong Shen, Jia-Min Shieh, Fu-Kuo Hsueh, Bo-Yuan Chen, Da-Chiang Chang, Wen-Kuan Yeh, Kuan-Neng Chen, Chenming HU
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e753795da2e98accd117b4cb00b8e677
https://doi.org/10.1109/iedm19574.2021.9720512
https://doi.org/10.1109/iedm19574.2021.9720512
Autor:
Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Chih-I Cho, Ming-Wei Weng, Jui-Han Liu, Kuan-Neng Chen
Publikováno v:
Applied Surface Science. 592:153243
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f816ae55e640ea371518e13470dc5f9f
https://doi.org/10.1016/j.apsusc.2022.153243
https://doi.org/10.1016/j.apsusc.2022.153243
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this study, using metal passivation (Au or Pd), chip-level Cu to Cu bonding with $15\times 15\ \mu\mathrm{m}^{2}$ bump size and 15 µm bump pitch has been achieved at 180°C for 30 seconds under the atmosphere. The good bonding results have been c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a87d63757147b5f71780e388b393675
https://doi.org/10.1109/ectc32696.2021.00065
https://doi.org/10.1109/ectc32696.2021.00065
Autor:
Zhong-Jie Hong, 洪仲頡
106
In this research, the broadband light (from 365-940 nm) and room temperature gas (NO, CO) sensing can be achieved by using nano-heterojunction (Ge and SnO2 nanowire) device; the detail analysis can be measured by in-situ spectrum and electri
In this research, the broadband light (from 365-940 nm) and room temperature gas (NO, CO) sensing can be achieved by using nano-heterojunction (Ge and SnO2 nanowire) device; the detail analysis can be measured by in-situ spectrum and electri
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/8yn3d6
Autor:
Li-Wei Huang, Yong-Jia Wang, Zhong-Jie Hong, Chun-Yen Lai, Ping-Hung Yeh, Po-Hao Lai, Wen-Wei Wu
Publikováno v:
ECS Meeting Abstracts. :2459-2459
Over the past few decades of research on the nature inspired material has given us new opportunities and challenges. The focus of nature inspired material not only inspired people’s imagination and hope, but also combined many study filed like arch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bd58b8464f242e0c946c123f5d6c286
https://doi.org/10.1149/ma2018-01/42/2459
https://doi.org/10.1149/ma2018-01/42/2459
Autor:
Liu, Demin, Kuo, Tsung-Yi, Liu, Yu-Wei, Hong, Zhong-Jie, Chung, Ying-Ting, Chou, Tzu-Chieh, Hu, Han-Wen, Chen, Kuan-Neng
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Apr2021, Vol. 11 Issue 4, p573-578, 6p