Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Zhiyuan Lai"'
Publikováno v:
Materials, Vol 17, Iss 9, p 2134 (2024)
Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a m
Externí odkaz:
https://doaj.org/article/ab31689b512444be818fa55b51ba6264
Autor:
Quanze JIANG, Zhiyuan LAI
Publikováno v:
Dianxin kexue, Vol 32, Pp 175-181 (2016)
From the current development situation of SDN technology,characteristics of CMNet were analyzed.Then the CMNet evolution was divided into three stages:firstly,focused on the application of the key scenes in metro area; secondly,gradually expanded to
Externí odkaz:
https://doaj.org/article/ca060f50b7754acc96931291f1dde002
Publikováno v:
Dianxin kexue, Vol 29, Pp 131-140 (2013)
From the competitive situation of internet broadband services in domestic operators,CMNet MAN business network architecture situation and existing problems were analyzed combined with the trends of the broadband business application development.The
Externí odkaz:
https://doaj.org/article/3629ade69369431dbd657fa536797422
Publikováno v:
Journal of Materials Processing Technology. 311:117820
Publikováno v:
Journal of Materials Processing Technology. 304:117551
Autor:
Yang, Zixing1 (AUTHOR) 22011080017@stu.hqu.edu.cn, Huang, Hui1,2,3 (AUTHOR) huangh@hqu.edu.cn, Liao, Xinjiang2,3 (AUTHOR) xinjiangliao@sina.cn, Lai, Zhiyuan1 (AUTHOR) 1611403003@stu.hqu.edu.cn, Xu, Zhiteng1 (AUTHOR) 20011080016@stu.hqu.edu.cn, Zhao, Yanjun4 (AUTHOR) zyj@zzsm.com
Publikováno v:
Materials (1996-1944). May2024, Vol. 17 Issue 9, p2134. 15p.
Autor:
Liang, Lie1 (AUTHOR), Li, Shujuan1 (AUTHOR) shujuanli@xaut.edu.cn, Lan, Kehao1 (AUTHOR), Yu, Ruijiang1 (AUTHOR), Wang, Jiabin1 (AUTHOR), Zhao, Wen1 (AUTHOR)
Publikováno v:
Materials (1996-1944). May2023, Vol. 16 Issue 10, p3619. 16p.
Publikováno v:
Micromachines; Jun2023, Vol. 14 Issue 6, p1275, 17p
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing; Aug2019, Vol. 32 Issue 3, p352-358, 7p
This is an open access book. ICEKIM is an annual conference that has been held four times. 2024 5th International Conference on Education, Knowledge and Information Management (ICEKIM 2024) will be held on April 19–21, 2024 in Chengdu, China. Infor