Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Zhihuan Lan"'
Publikováno v:
2022 IEEE 10th Joint International Information Technology and Artificial Intelligence Conference (ITAIC).
Publikováno v:
Proceedings of the 2016 2nd Workshop on Advanced Research and Technology in Industry Applications.
Publikováno v:
physica status solidi (b). 247:444-448
The effects of tin interstitial (Sni), oxygen vacancy (VO), and Sni + VO defect pair on the electronic structure and magnetic properties of undoped SnO2 are investigated by means of density functional calculations. Only single positively charged O va
Publikováno v:
Proceedings of the 3rd International Conference on Mechanical Engineering and Intelligent Systems (ICMEIS 2015).
In the research of multi-spectral radiation thermometry, temperature measurement depends on the line shape of spectrum radiation remittance. However, in the actual measurement, the combustion, explosion and gasification on special occasions can produ
In the effective mass approximation, electronic property in graphene can be characterized by the relativistic Dirac equation. Within such a continuum model we investigate the electronic transport through graphene waveguides formed by connecting multi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7567c6207fab046605c3d79c793bdee0
http://arxiv.org/abs/0811.3336
http://arxiv.org/abs/0811.3336
Publikováno v:
Physica Status Solidi (B); Feb2010, Vol. 247 Issue 2, p444-448, 5p
Publikováno v:
Physica Status Solidi (B); Feb2010, Vol. 247 Issue 2, p229-233, 5p
Autor:
A. Wu
Selected, peer reviewed papers from the 2013 3rd International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia
Selected, peer reviewed papers from the 2014 International Conference on Advances in Materials Science and Information Technologies in Industry (AMSITI 2014), January 11-12, 2014, Xi'an, China
Selected, peer reviewed papers from the 2014 International Conference on Materials Science and Computational Engineering (ICMSCE 2014), May 20-21, 2014, Qingdao, China