Zobrazeno 1 - 10
of 48
pro vyhledávání: '"Zhifeng Dou"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1914-1921
Publikováno v:
Journal of Electrical Engineering & Technology. 18:1111-1122
Publikováno v:
IEEE Transactions on Plasma Science. 50:2256-2262
Publikováno v:
IEEE Transactions on Transportation Electrification. 8:1575-1589
In this paper, an inductance on-line identification method is proposed for model predictive control (MPC) of vehicle-to-grid (V2G) inverter with enhanced robustness against grid frequency deviation. Firstly, a full-order sliding mode observer is esta
Autor:
Qimin Peng, Xue Shao, Chuan Hu, Zuyang Luo, Tayirjan Taylor Isimjan, Zhifeng Dou, Ruobing Hou, Xiulin Yang
Publikováno v:
Journal of Colloid and Interface Science. 615:577-586
Publikováno v:
Energies, Vol 13, Iss 19, p 5022 (2020)
As much wind power is integrated into the power grid through power electronic equipment, the use of wind power is increased rapidly. Wind power system makes the power grid lack inertia and damping, thereby reducing power grid stability; in severe cas
Externí odkaz:
https://doaj.org/article/d079e4e6cce04f83b902536c22e1b0e7
Publikováno v:
IEEE Transactions on Plasma Science. 49:3154-3161
Superconducting pulsed power supplies (SPPSs) have attracted more and more attention because of their advantages of high energy storage density, long energy storage time, low loss, and low power requirements for charging power sources. In order to im
Autor:
Min Liu, Yong Chen, Ke Chen, Na Zhang, Xiaoqin Zhao, Fenghui Zhao, Zhifeng Dou, Xiangming He, Li Wang
Publikováno v:
BioResources, Vol 10, Iss 1, Pp 155-168 (2014)
High-surface-area activated carbon (HSAAC) was synthesized by carbonizing coconut shells and subsequently activating the material with KOH. The as-prepared HSAAC had a mostly microporous structure (with small mesoporous inclusions) and exhibited a hi
Externí odkaz:
https://doaj.org/article/79bfa7477cff449a905c9b53ea8afa65
Publikováno v:
2022 IEEE 5th International Conference on Electronics Technology (ICET).
Publikováno v:
SSRN Electronic Journal.