Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Zhidong WEN"'
Autor:
Yifan Wang, Zhidong Wen, Yaoyao Yang, Xiangting Hu, Zhizhong Song, Haijing Hu, Guoyue Song, Lunhe You, Jianrui Wang, Yu Liu, Xianhao Cheng, Xiaoyan Zhang
Publikováno v:
International Journal of Molecular Sciences, Vol 25, Iss 11, p 5677 (2024)
Mycoviruses are usually transmitted horizontally via hyphal anastomosis and vertically through sporulation in natural settings. Oyster mushroom spherical virus (OMSV) is a mycovirus that infects Pleurotus ostreatus, with horizontal transmission via h
Externí odkaz:
https://doaj.org/article/c956ef6862704cb9b5a50aa6c7268e18
Autor:
Zhidong Wen, Haiyan Shi, Song Yue, Man Li, Zhe Zhang, Ran Wang, Qi Song, Ziye Xu, Zichen Zhang, Yu Hou
Publikováno v:
Frontiers in Physics, Vol 10 (2022)
Black silicon is a promising and effective candidate in the field of photoelectric devices due to the high absorptance and broad-spectrum absorption property. The deposition around the processing area induced by the pressure of SF6, gravity, and the
Externí odkaz:
https://doaj.org/article/81499ddc51094e5c9b17c68c4b04e4b0
Autor:
Zhidong Wen, Shunshuo Cai, Zhe Zhang, Ziye Xu, Qi Song, Kunpeng Zhang, Man Li, Haiyan Shi, Yu Hou, Zichen Zhang
Publikováno v:
Nanomaterials, Vol 12, Iss 23, p 4285 (2022)
Various antireflective structures and methods are proposed to solve the optical loss of Si-based absorber devices. Dual-scale structures have received more concern from researchers in recent years. In this study, the finite difference time domain (FD
Externí odkaz:
https://doaj.org/article/7d9d71d7cde7400dbf9971ba40133403
Autor:
Zhidong Wen, Zhe Zhang, Kunpeng Zhang, Jiafa Li, Haiyan Shi, Man Li, Yu Hou, Mei Xue, Zichen Zhang
Publikováno v:
Nanomaterials, Vol 12, Iss 10, p 1772 (2022)
Black silicon, which is an attractive material due to its optical properties, is prepared mainly by laser inducing in an SF6 atmosphere. Considering the effect of SF6 gas on the environment and human health, here we propose an efficient, economical,
Externí odkaz:
https://doaj.org/article/e4576e89db284ac18fcf7db3e1085255
Publikováno v:
Micromachines, Vol 12, Iss 11, p 1331 (2021)
SiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high failure rate during the dicing process. In this study, a novel dual laser beam asynchronous dicing method (DBAD) is proposed to improve the cutting quality of S
Externí odkaz:
https://doaj.org/article/5e1b2f6864fd48049b59a688553a88ab
Autor:
Zhidong Wen1 syj8905@126.com, Xiongbo Bie2 kuailedexiaobie@163.com, Shilei Tan3 tanshilei@ustc.edu.cn
Publikováno v:
Engineering Letters. Mar2024, Vol. 32 Issue 3, p503-511. 9p.
Publikováno v:
International Journal of Pattern Recognition and Artificial Intelligence. 36
Rice variety identification is important for genetic breeding classification and crop yield estimation. Traditional identification methods are time-consuming and inaccurate. This paper proposes a method for rice variety identification based on the hy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03fb28f015674131e3833935c0d8dff5
https://doi.org/10.1142/s0218001423500015
https://doi.org/10.1142/s0218001423500015
Autor:
Zhidong WEN, Shilei TAN
Publikováno v:
Proceedings of the Romanian Academy, Series A: Mathematics, Physics, Technical Sciences, Information Science; Jul-Sep2023, Vol. 24 Issue 3, p279-290, 12p
Autor:
Qi Song, Zhe Zhang, Ziye Xu, Zhidong Wen, Haiyan Shi, Kunpeng Zhang, Man Li, Zichen Zhang, Yu Hou, Zhengxun Song
Publikováno v:
ECS Journal of Solid State Science and Technology. 12:033012
Silicon carbide (SiC), due to its characteristic materials performance, gets more attention in Radio Frequecy (RC) and High-power device fabrication. However, SiC wafer dicing has been a tricky task because of the high hardness and brittleness. The b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4c521621a1bf08b879a38cf74e7d96c
https://doi.org/10.1149/2162-8777/acc135
https://doi.org/10.1149/2162-8777/acc135
Publikováno v:
Micromachines
Micromachines, Vol 12, Iss 1331, p 1331 (2021)
Volume 12
Issue 11
Micromachines, Vol 12, Iss 1331, p 1331 (2021)
Volume 12
Issue 11
SiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high failure rate during the dicing process. In this study, a novel dual laser beam asynchronous dicing method (DBAD) is proposed to improve the cutting quality of S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fe55743d3c40e65dee7666d9e6b2e17f
https://pubmed.ncbi.nlm.nih.gov/34832743
https://pubmed.ncbi.nlm.nih.gov/34832743