Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zhi-Dong Xia"'
Publikováno v:
Advanced Materials Research. :119-122
This study was carried out to discuss the influence of curing temperature on the performance of conductive composites filled with nickel-coated graphite (NCG). The electrical conductivity, crosslink density, mechanical properties and tensile fracture
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbdbc489e72ccd6da9afbd8215a87c4b
https://doi.org/10.4028/www.scientific.net/amr.750-752.119
https://doi.org/10.4028/www.scientific.net/amr.750-752.119
Publikováno v:
Advanced Materials Research. :15-20
One of the main hurdles for the wide use of current Ag-filled conductive composites is the high cost of Ag fillers, while the challenge for low cost copper-filled composites is their poor reliability. In this study, the Ag-coated Cu flakes was chosen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff519d38b08e251d55abcf43a2a4d6f4
https://doi.org/10.4028/www.scientific.net/amr.287-290.15
https://doi.org/10.4028/www.scientific.net/amr.287-290.15
Effect of Thixotropic Agent on the Properties of Conductive Silicone Rubber Gasket for EMI Shielding
Publikováno v:
Advanced Materials Research. :3350-3353
In this study, a thixotropic agent was applied to improve the aspect ratio of the silicone rubber gasket and the resulting obtained through modification showed an increase in aspect ratio from 0.26 to 0.91 with the relative to the gasket without thix
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d14653c6342aa84b3f548a6d018b26a8
https://doi.org/10.4028/www.scientific.net/amr.239-242.3350
https://doi.org/10.4028/www.scientific.net/amr.239-242.3350
Publikováno v:
Journal of Electronic Materials. 37:1751-1755
The effects of rare-earth (RE) element additions on the tensile deformation mechanism of the Sn-3.8Ag-0.7Cu solder alloy have been investigated. The results show that adding RE elements can remarkably improve the tensile strength and elongation of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b46a32c760dbdc95809ac21d0079903
https://doi.org/10.1007/s11664-008-0532-2
https://doi.org/10.1007/s11664-008-0532-2
Publikováno v:
Journal of Electronic Materials; Jan2008, Vol. 37 Issue 1, p125-133, 9p, 4 Diagrams, 3 Charts, 4 Graphs