Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Zhenxue Han"'
Publikováno v:
Surface Innovations. :1-11
Large Leidenfrost drops may be unstable when their diameters exceed a critical value. Through theoretical and experimental investigations, this study explored the feasibility of suppressing Leidenfrost instability in a large container, by meshing the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92dbdb479d8a2b2741cdb0ee4af3c113
https://doi.org/10.1680/jsuin.22.01085
https://doi.org/10.1680/jsuin.22.01085
Publikováno v:
Surface Innovations. :1-12
Leidenfrost drops have demonstrated promising applications in, for example, drag reduction. However, large Leidenfrost drops may be unstable when their diameters exceed a critical value, leading to less control of such drops in their applications. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::782909930766d58ebd6054ce205257bb
https://doi.org/10.1680/jsuin.22.01066
https://doi.org/10.1680/jsuin.22.01066
Publikováno v:
Microelectronics Reliability. 44:1977-1983
In this study, a simulation-based multi-objective design optimization methodology was developed for improving electronic packaging reliability. It was demonstrated using a generic model of an electronic package on a printed wiring board. The objectiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67a95ec5f5cd92e5a9ecba1001ab3304
https://doi.org/10.1016/j.microrel.2004.04.024
https://doi.org/10.1016/j.microrel.2004.04.024
Publikováno v:
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).
Stress analysis of a two-layer wire bonded plastic ball grid array (WB-PBGA) package has been carried out to study the effect of adhesively bonded heat sink. A three dimensional finite element model of the WB-PBGA package and the printed wiring board
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87476e2f670d81f774865d251525fa26
https://doi.org/10.1109/itherm.2002.1012555
https://doi.org/10.1109/itherm.2002.1012555
Autor:
Dennis, B.H., Zhenxue Han, Weiya Jin, Bo Ping Wang, Leon Xu, Aapro, T., Ptchelintsev, A., Reinikainen, T.
Publikováno v:
EuroSime 2006 - 7th International Conference on Thermal, Mechanical & Multiphysics Simulation & Experiments in Micro-Electronics & Micro-Systems; 2006, p1-5, 5p
Publikováno v:
ITherm 2002. Eighth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258); 2002, p926-931, 6p