Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zhengping Ou"'
Publikováno v:
Journal of Manufacturing Processes. 84:394-402
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Wire bonding (WB) have been widely used in 3D stacked integrated microelectronic packaging because of its high reliability and low-cost. In 3D stacked packaging, the required size for microelectronic devices was much smaller than before, which led th
Publikováno v:
Sensors and Actuators B: Chemical. 359:131530
Publikováno v:
E3S Web of Conferences, Vol 165, p 03012 (2020)
With the rapid development of Internet cloud computing technology, big data and visualization and other new technologies, the powerful data storage, calculation and analysis capabilities of new technologies provide favorable conditions for improving
Externí odkaz:
https://doaj.org/article/9b100f0af9f349559db0e51ae7034648