Zobrazeno 1 - 1
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pro vyhledávání: '"Zheng-Ru Tsai"'
Publikováno v:
VLSI-DAT
Three-dimensional integration is considered a promising solution to cure the challenges of performance, power consumption, quality, and reliability issues. The feature of 2.5D ICs is that the dies are stacked on a passive silicon interposer and the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbbe2bc6d39e9edf5658febc5f5ac695
https://doi.org/10.1109/vlsi-dat.2014.6834878
https://doi.org/10.1109/vlsi-dat.2014.6834878
