Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zheng Lang Jia"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. :1-12
Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Publikováno v:
2022 International Applied Computational Electromagnetics Society Symposium (ACES-China).
Publikováno v:
2022 International Applied Computational Electromagnetics Society Symposium (ACES-China).
Publikováno v:
2021 13th Global Symposium on Millimeter-Waves & Terahertz (GSMM).
With the continuous improvement of the technological level of integrated circuits (ICs), the operating frequency and integration density are becoming higher and higher, which brings huge challenges to the simulation of integrated circuits. On one han