A study in flip-chip UBM/bump reliability with effects of SnPb solder composition

Autor: Wu, J.D., Zheng, P.J., Lee, C.W., Hung, S.C., Lee, J.J.

Publikováno v: In Microelectronics Reliability 2006 46(1):41-52

Board level reliability of a stacked CSP subjected to cyclic bending

Autor: Wu, J.D, Ho, S.H, Huang, C.Y, Liao, C.C, Zheng, P.J, Hung, S.C

Publikováno v: In Microelectronics Reliability 2002 42(3):407-416

Effects of substrate metallization on the degradation of flip chip interconnects under electromigration.

Autor: Wu, J.D., Lee, C.W., Zheng, P.J., Li, S.

Publikováno v: 2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, p25-30, 6p

Board level reliability test of MPBGA assembly.

Autor: Chi-Sheng Chung, Zheng, P.J., Lee, S.C., Wu, J.D.

Publikováno v: Proceedings of the 4th International Symposium on Electronic Materials & Packaging, 2002; 2002, p245-252, 8p

Electromigration failures of UBM/bump systems of flip-chip packages.

Autor: Wu, J.D., Zheng, P.J., Lee, K., Chiu, C.T., Lee, J.J.

Publikováno v: 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p452-457, 6p