Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Zhekun Peng"'
Autor:
Yanxiao Li, Zhekun Peng, Natalie J. Holl, Md. Rifat Hassan, John M. Pappas, Congjie Wei, Omid Hoseini Izadi, Yang Wang, Xiangyang Dong, Cheng Wang, Yue-Wern Huang, DongHyun Kim, Chenglin Wu
Publikováno v:
ACS Omega, Vol 6, Iss 10, Pp 6643-6653 (2021)
Externí odkaz:
https://doaj.org/article/23f195df84c741f482084ab381706130
Autor:
Yang Wang, Yue-Wern Huang, Dong-Hyun Kim, Natalie J. Holl, John M. Pappas, Omid Hoseini Izadi, Chenglin Wu, Cheng Wang, Yanxiao Li, Md. Rifat Hassan, Congjie Wei, Zhekun Peng, Xiangyang Dong
Publikováno v:
ACS Omega, Vol 6, Iss 10, Pp 6643-6653 (2021)
ACS Omega
ACS Omega
An MXene-graphene field-effect transistor (FET) sensor for both influenza virus and 2019-nCoV sensing was developed and characterized. The developed sensor combines the high chemical sensitivity of MXene and the continuity of large-area high-quality
Publikováno v:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium.
The standards for radiated emissions (RE) test in FCC Part 15 and CISPR 32, and the related literature concerning the limit line extrapolation, testing methods and challenges in the RE test are reviewed herein. In particular, factors to be considered
Autor:
Zhekun Peng, David Pommerenke, Ali Foudazi, Daryl G. Beetner, Shubhankar Marathe, Dong-Hyun Kim, Hossein Rezaei, Giorgi Maghlakelidze, Cheung-Wei Lam
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Touchscreen displays can be susceptible to sparkless electrostatic discharge events. The energy observed by sensitive touchscreen circuitry can vary significantly with design parameters like the glass thickness, the capacitance between the sensor pad
Autor:
Runbing Hua, Hideki Shumiya, David Pommerenke, Zhekun Peng, Kenji Araki, Omid Hoseini, Dong-Hyun Kim, Shota Konno
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
An electrostatic discharge (ESD) happening on a commercial electronic device such as at the USB interface can induce soft-failure in the IC and disturb the normal operation of the device. This paper investigates the soft-failure behaviors of 14 comme