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Effects of Cu/Mg ratio on microstructure and properties of AA7085 alloys

Autor: Kanghua Chen, Zhe-min Zhu, Xian-zhe Wu, D.H. Xiao, Xiu-xiu Li

Publikováno v: Transactions of Nonferrous Metals Society of China. 24:2054-2060

AA7085 aluminum alloys with different Cu/Mg ratios (0.67, 1.0, 1.06, 1.6) were prepared by ingot metallurgy method. The effects of Cu/Mg ratio on the microstructure, mechanical properties and corrosion behavior of the AA7085 alloys were investigated

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::21f7a3a2886d0dee59846a797fbfe7d2
https://doi.org/10.1016/s1003-6326(14)63311-2

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Effect of Minor Silver Addition on Microstructure and Properties of Al-8Zn-1.Cu-1.3Mg-0.1Zr Alloys

Autor: Kanghua Chen, Zhe-min Zhu, D.H. Xiao, X.Z. Wu, Xinhai Li

Publikováno v: Advanced Materials Research. :360-363

Effects of minor silver addition on microstructure, mechanical properties and corrosion resistances of Al-8Zn-1.Cu-1.3Mg-0.1Zr alloys were investigated using optical microscope (OM), scanning electron microscopy (SEM), mechanical properties and corro

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0e376b67c03d3e4ecac59984b3972fb9
https://doi.org/10.4028/www.scientific.net/amr.834-836.360

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Electrical Reliability Issues of Integrating Thin Ta and TaN Barriers with Cu and Low‐K Dielectric

Autor: Chau Chiung Wang, Mao-Chieh Chen, Chung I. Chang, Zhe Min Zhu, Yu Lin Liu, Peng Sen Chen, Zhen Cheng Wu, Ren Guay Wu, Jiann Fu Chen, L. J. Chen

Publikováno v: Journal of The Electrochemical Society. 146:4290-4297

This work investigates the integration of very thin sputtered Ta and reactively sputtered TaN barriers with Cu and a low‐dielectricconstant (low‐K) layer of poly(arylene ether) (PAE‐2). It is found that Cu readily penetrates into PAE‐2 and de

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b16d6cda2c0174449bd6a38e09fe2ab2
https://doi.org/10.1149/1.1392629

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