Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Zhaoxi Su"'
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 71:1-7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e215b69992f593bd530b0653c9fac5c3
https://doi.org/10.1109/tim.2022.3204330
https://doi.org/10.1109/tim.2022.3204330
Publikováno v:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a76aa4753d99b8daa402654b2202d887
https://doi.org/10.1109/mems49605.2023.10052274
https://doi.org/10.1109/mems49605.2023.10052274
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c4afe909de498005eff5739ccfef7b7
https://doi.org/10.1109/icept56209.2022.9873466
https://doi.org/10.1109/icept56209.2022.9873466
Publikováno v:
Liquids, Vol 4, Iss 3, Pp 485-504 (2024)
Years of massive applications of high-throughput atomistic modeling tools such as molecular docking and end-point free energy calculations in the drug industry and academic exploration have made them indispensable parts of hierarchical screening. Whi
Externí odkaz:
https://doaj.org/article/dd04ca24843d477db7596e7c576a6327
Publikováno v:
2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ccd13e86f5d6dab30b23ae3a45f42f0
https://doi.org/10.1109/inertial53425.2022.9787759
https://doi.org/10.1109/inertial53425.2022.9787759
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6bf49cb26e039923df44d0c35b517a76
https://doi.org/10.1109/tcpmt.2023.3277597
https://doi.org/10.1109/tcpmt.2023.3277597
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
In this work, a novel approach for wafer-level vacuum packaging of MEMS resonant accelerometer is presented and experimentally demonstrated. 3D composite glass-silicon wafer based on glass reflow process is designed and fabricated as carrier wafer. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea3b07560aa981a507db8600599db62b
https://doi.org/10.1109/icept52650.2021.9568218
https://doi.org/10.1109/icept52650.2021.9568218
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
This paper investigates glass reflow process and thermo-mechanical stress of Through Glass Via (TGV) in glass-silicon composite interposer by Finite Element Analysis (FEA). The TGV structure in this work is composed of highly conductive silicon as ve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af1e1fc7cf7ebb81aabaf3e249e77133
https://doi.org/10.1109/icept52650.2021.9568206
https://doi.org/10.1109/icept52650.2021.9568206
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
This paper investigates the effects of resonator-electrode assembly errors on the electrostatic tuning ability in micro umbrella shell resonators. Theoretically analyzed the resonator-electrode capacitance effect, which refers to the stiffness adjust
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84f54ca7b38cc3fd820da1e8b50cfa27
https://doi.org/10.1109/icept52650.2021.9567996
https://doi.org/10.1109/icept52650.2021.9567996
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:567-574
This paper proposes to adjust shell heights of slim-stemmed microumbrella shells by a low-cost foaming process for regulating wineglass frequency. Titanium hydride (TiH2) is used as the foaming agents. They are sealed in the cavities of the bonded gl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a9c8d6caa08da61f8bc85d9d301850f
https://doi.org/10.1109/tcpmt.2018.2886957
https://doi.org/10.1109/tcpmt.2018.2886957