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Akademický článek
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Publikováno v:
ACS Nano; May 2024, Vol. 18 Issue: 19 p12377-12385, 9p
Publikováno v:
IEEE Transactions on Antennas and Propagation. 70:1309-1319
Wireless communications at millimeter-wave (mmW) frequencies suffer high propagation loss and low energy efficiency. The feeding circuits in dielectric substrates may also result in antenna excitation distortions in both phases and amplitudes. Antenn
Autor:
Zhao-He Lin, Hsi-Tseng Chou
Publikováno v:
2021 International Symposium on Antennas and Propagation (ISAP).
Publikováno v:
2021 International Symposium on Antennas and Propagation (ISAP).
Autor:
Pin-Zhong Shen, Ji-Cheng Lin, Hsi-Tseng Chou, Chieh-Wei Chou, Chao-Shun Yang, Zhao-He Lin, Kuan-Hsun Wu, Chi-Liang Pan, Ding-Bing Lin, Li-Chih Fang
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Realization of Antenna-in-Package (AiP) needs to resolve several performance instability challenges at millimeterwave (mmW) frequencies. They are caused by the uncertainties of material properties and mechanical fabrication limitations. In particular
Autor:
Chun-Te Lin, Pin-Zhong Shen, Chi-Liang Pan, Li-Chih Fang, Zhao-He Lin, Ding-Bing Lin, Ji-Cheng Lin, Hsi-Tseng Chou, Chao-Shun Yang, Chieh-Wei Chou
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Design of Antenna-in-Module (AiM) is presented to realize active and reconfigurable antenna arrays for potential 5G applications at millimeter-wave (mmW) frequencies. Due to the large array configuration, transmission line loss in the dielectric subs
Autor:
Chao-Shun Yang, Li-Chih Fang, Ji-Cheng Lin, Hsi-Tseng Chou, Ding-Bing Lin, Chi-Liang Pan, Zhao-He Lin, Chun-Te Lin, Kuan-Hsun Wu, Chieh-Wei Chou, Pin-Zhong Shen
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In this paper, an active antenna-in-package (AiP) design at millimeter wave frequencies (mmW) is presented for user equipment (UE) and customer-premises equipment (CPE) applications. In particular, the UE and CPE AiP implements 4 × 4 and 6 × 6 micr
Publikováno v:
Nano Letters; 20240101, Issue: Preprints