Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Zhanyun Liu"'
Autor:
Jianglei Fan, Jiaojiao Wang, Xiao Wang, Zhanyun Liu, Shen Wu, Yan Wang, Ying Li, Xiangkui Zhou, Shizhong Wei
Publikováno v:
Journal of Materials Research and Technology, Vol 29, Iss , Pp 2585-2596 (2024)
Improving mechanical properties of solder alloy can result in a decrease of its conductivity. The decrease in conductivity of the solder increases the generation of Joule heat and reduces the reliability of the joint. This problem can be solved by ad
Externí odkaz:
https://doaj.org/article/71ccc14620dd4cfe9d81e49713442696
Publikováno v:
Journal of Materials Engineering and Performance. 29:4934-4943
Sn-Cu based solders have been widely investigated due to their good mechanical properties, good fluidity, narrow melting range, environmental friendliness, and low price. In this paper, the effect of Ni content on the microstructure, mechanical prope
Autor:
Gao Hongxia, Yan Wang, Hengtao Zhai, Ying Li, Jianglei Fan, Jianxiu Liu, Xiao Wang, Xiangkui Zhou, Zhanyun Liu
Publikováno v:
Journal of Electronic Materials. 49:2660-2668
The effect of Co addition (0.5-2.0 wt.%) on the microstructure evolution, thermal and mechanical property of Sn-0.7Cu (wt.%) solder was investigated. The microstructure of Sn-Cu alloy was refined with the addition of Co, and CoSn2 phase formed during
Autor:
Yan Wang, Zhanyun Liu, Wu Shen, Ying Li, Jianglei Fan, Liang Liubo, Yuwen Li, Xiao Wang, Gao Hongxia
Publikováno v:
Materials Science and Technology. 35:891-899
Intermetallic TiAl alloys are new generation high-temperature material. However, extensive application of TiAl alloys is hindered by some disadvantages, especially the high processing cost. Currently, precision casting is an effective method to manuf
Autor:
Zhanyun Liu, Wu Shen, Xingxing Wang, Yuwen Li, Yanhong Guo, Jianglei Fan, Xiao Wang, Jianxiu Liu
Publikováno v:
Materials Chemistry and Physics. 217:527-532
Cu-based bearing shell containing Ni layer was prepared by centrifugal casting. The effect of Ni layer on the microstructure evolution and mechanical property of Cu-based bearing shell with aging treatment was studied. The microstructure of the Sn-Sb
Autor:
Wu Shen, Jianxiu Liu, Ying Li, Jianglei Fan, Xiao Wang, Yan Wang, Xiangkui Zhou, Hengtao Zhai, Zhanyun Liu
Publikováno v:
Microelectronics Reliability. 107:113615
The effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu (mass%, mass fraction except specified) based lead-free solder was studied in this paper. With the addition of Co, the microstructure of