Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Zhangjian, Zhao"'
Publikováno v:
Materials Express. 11:1628-1635
Apoptosis signal-regulating kinase 1 (ASK1) signaling is involved in the occurrence and progression of diabetic nephropathy (DN) renal fibrosis, yet the detection of ASK1 requires further investigation. To explore the effect of magnetic nanomaterials
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b37536b9439b78c952f99cc9f7f58e3
https://doi.org/10.1166/mex.2021.2071
https://doi.org/10.1166/mex.2021.2071
Autor:
Li Dai, Hanlei Song, Zhangjian Zhao, Zengqi Xue, Shanshan Li, Huanlin Jin, Xiangliang Xue, Chusheng Miao, Ruiyu Zhao
Publikováno v:
Seminars in Dialysis
Background To explore the effects of different calcium concentrations of peritoneal dialysis solution (PDS) on continuous ambulatory peritoneal dialysis (CAPD) and expression of vimentin (VIM), fibroblast‐specific protein (FSP1), and E‐cadherin.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8b625bd275ec0f47d717f3d6594c035f
https://pubmed.ncbi.nlm.nih.gov/33029812
https://pubmed.ncbi.nlm.nih.gov/33029812
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 97:3625-3636
The engine oil pan is used for restraining pollutant and gathering greasing oil from the engine components’ surface which is significant for thermal dissipation and preventing deterioration of oil quality. The study intended to investigate and deve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::775c4b667598e6a1b1b8b81fbf794e6a
https://doi.org/10.1007/s00170-018-2124-5
https://doi.org/10.1007/s00170-018-2124-5
Publikováno v:
Electronic Materials Letters. 14:526-532
The effects of Sn layer orientation on the evolution of Cu/Sn joint interfaces were investigated. Three Sn layers possessing (112), (321) and (420) orientations were electroplated on polycrystalline Cu substrates respectively. The orientations of Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a8b73bc9de40bae9a689774bcaa6c66
https://doi.org/10.1007/s13391-018-0048-8
https://doi.org/10.1007/s13391-018-0048-8
Autor:
Zhangjian Zhao, Yong Xu, Dayong Chen, Yan Ma, Jingming Li, Guoqing Chen, S. H. Zhang, Ali Abd El-Aty
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 91:2369-2381
This study was carried out to investigate the effect of preliminary processes on tube hydroforming (THF) and to optimize the THF process parameters to achieve a sound complex 3D curved intercooler pipe without failure by numerical and experimental ap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7ad26fb7de8e34901df937ecf7330b7
https://doi.org/10.1007/s00170-016-9920-6
https://doi.org/10.1007/s00170-016-9920-6
Publikováno v:
Am J Transl Res
STAT3/mTOR pathway plays an important role in inflammation, cell growth, and proliferation. However, the role of STAT3/mTOR pathway in chronic kidney injury remains unclear. Folic acid was used to induce kidney injury C57BL/6 mouse model followed by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::918bc3f4468cc47c3e1e3dff4d62e4f5
https://pubmed.ncbi.nlm.nih.gov/32774701
https://pubmed.ncbi.nlm.nih.gov/32774701
Publikováno v:
Materials Letters. 185:92-95
Three Sn layers of different grain size were electroplated on Cu foils to investigate the effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 during aging. In the early stage, scallop Cu6Sn5 formed in three joints. For the joint
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83e7012d971998570f8f2ed166daea28
https://doi.org/10.1016/j.matlet.2016.08.115
https://doi.org/10.1016/j.matlet.2016.08.115
Publikováno v:
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, we reported a study on the effect of solder volume on the intermetallic layer morphology and thickness in the Ni/Sn/Cu system wi th 10µm, 20µm, 40µm Sn layer. The content of Cu and Ni in the solder increased wi th the reducing of so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90f61404e36f75c050cd1b0f3bb5b191
https://doi.org/10.1109/icept.2015.7236623
https://doi.org/10.1109/icept.2015.7236623