Zobrazeno 1 - 10
of 166
pro vyhledávání: '"Zhang, Zikang"'
Autor:
Qiao, Dan, Su, Yi, Wang, Pinzheng, Ye, Jing, Xie, Wenjing, Zhou, Yuechi, Ding, Yuyang, Tang, Zecheng, Wang, Jikai, Ji, Yixin, Wang, Yue, Guo, Pei, Sun, Zechen, Zhang, Zikang, Li, Juntao, Chao, Pingfu, Chen, Wenliang, Fu, Guohong, Zhou, Guodong, Zhu, Qiaoming, Zhang, Min
Large Language Models (LLMs) have played an important role in many fields due to their powerful capabilities.However, their massive number of parameters leads to high deployment requirements and incurs significant inference costs, which impedes their
Externí odkaz:
http://arxiv.org/abs/2405.05957
Autor:
Ge, Yao, Tang, Chong, Li, Haobo, Zhang, Zikang, Li, Wenda, Chetty, Kevin, Faccio, Daniele, Abbasi, Qammer H., Imran, Muhammad
Nowadays, non-privacy small-scale motion detection has attracted an increasing amount of research in remote sensing in speech recognition. These new modalities are employed to enhance and restore speech information from speakers of multiple types of
Externí odkaz:
http://arxiv.org/abs/2303.08295
Publikováno v:
In International Communications in Heat and Mass Transfer November 2024 158
Publikováno v:
In Applied Thermal Engineering 15 October 2024 255
Publikováno v:
In Case Studies in Thermal Engineering September 2024 61
Autor:
Zhang, Zhaoxian, Jia, Yaoyi, Zhang, Chenghui, Zhang, Zikang, Jin, Fangsha, Pan, Dandan, Li, Daxiang, Wu, Xiangwei
Publikováno v:
In Journal of Hazardous Materials 5 May 2024 469
Autor:
Li, Ji, Zhang, Zikang, Zhang, Yifan, Zhao, Runze, Cui, Haichuan, Zhai, Tianyou, Liu, Wei, Liu, Zhichun
Publikováno v:
In International Journal of Heat and Mass Transfer April 2024 221
Publikováno v:
He jishu, Vol 47, Iss 6, Pp 060501-060501 (2024)
BackgroundIn the nuclear industry, zirconium alloys, employed as structural materials, undergo irradiation-induced deformation owing to the combined effects of thermo, mechanical stress, and neutron irradiation during the irradiation process, thereby
Externí odkaz:
https://doaj.org/article/be5fcf65470d4f6d850520c37e6917c9
Publikováno v:
In Microelectronics Reliability February 2024 153