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pro vyhledávání: '"Zhang, Tongjun Niu"'
Autor:
Zhang, Tongjun Niu, Ke Xu, Chao Shen, Tianyi Sun, Justin Oberst, Carol A. Handwerker, Ganesh Subbarayan, Haiyan Wang, Xinghang
Publikováno v:
Crystals; Volume 13; Issue 7; Pages: 989
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=multidiscipl::8b9a0c4ff2a2431cc0d39cb01e763727
