Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Zezhong Fu"'
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 7:11-18
Within the assembly world, problems related to package contamination, which stem from material sourcing and assembly process excursions, can impact product reliability. From the reliability perspective, it is essential to achieve integrity at all int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59b08a250191b415f1b9a066b505cb3d
https://doi.org/10.1109/tdmr.2007.900057
https://doi.org/10.1109/tdmr.2007.900057
Publikováno v:
ASME 2009 InterPACK Conference, Volume 1.
Electromigation behavior of solder joints with thick Cu column was studied. The failure mechanisms for both SnPb and SnAg solder joints were discussed. To better understand the mechanisms, voids nucleation and propagation were also studied through Ke
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abccfd9f689807c993d574b42ad07540
https://doi.org/10.1115/interpack2009-89023
https://doi.org/10.1115/interpack2009-89023
Publikováno v:
JOM. 51:19-21
This article addresses the subtle changes necessary to achieve a margin against an intrinsic failure mechanism in a highly time-constrained development world. The problem of a coefficient of thermal expansion mismatch between a liquid crystal polymer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77aedf68ec0fb1286070292d9def537f
https://doi.org/10.1007/s11837-999-0022-x
https://doi.org/10.1007/s11837-999-0022-x
Publikováno v:
International Symposium for Testing and Failure Analysis.
Next generation assembly/package development challenges are primarily increased interconnect complexity, density, and multi-layer/multi-stacked packages with ever shorter development time. The results of this trend present some distinct challenges fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27e59faf5841c58c6e0846e2e832678e
https://doi.org/10.31399/asm.cp.istfa2003p0056
https://doi.org/10.31399/asm.cp.istfa2003p0056
Publikováno v:
IEEE Transactions on Device & Materials Reliability; Mar2007, Vol. 7 Issue 1, p11-18, 8p
Publikováno v:
Physica A: Statistical Mechanics and its Applications; February 1988, Vol. 148 Issue: 1-2 p61-73, 13p
Autor:
William L. Johnson, Paul Pietrokowsky, Zezhong Fu, David S. Lee, Konrad Samwer, Egon Hellstern
Publikováno v:
MRS Proceedings. 99
We have studied the phase transition of the oxygen sublattice in the YBa2Cu3O7−x system by Differential Scanning Calorimetry (DSC), Guinier Camera, and high temperature x-ray diffraction (ht-xrd) techniques. The transition was examined under differ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cd0632870a825079c0158a8c480f303
https://doi.org/10.1557/proc-99-923
https://doi.org/10.1557/proc-99-923