Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Zeya Peng"'
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Autor:
Xiaochi Ma, Mowei Shen, Zhen Chen, Ci Wang, Ying Zhou, Zeya Peng, Zaifeng Gao, Zheng Ma, Mengge Yao
Publikováno v:
International Journal of Human–Computer Interaction. 34:238-250
Most gestural interaction studies on gesture elicitation have focused on hand gestures, and few have considered the involvement of other body parts. Moreover, most of the relevant studies used the ...
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1043:022024
The electronic components are the core of all electronic products, the reliability and maintainability directly affect manufacture products quality. And as products become more complex and more demanding. We need more reliable components. In order to
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
The stresses, reliability issues and failure mechanisms of IC in post second level assembly state are significant different IC in free standing state. Based on the full step analysis of electronic assembly process, this paper demonstrated the possibl
Autor:
Yuqi Yao, Ziang Xiao, Hanfei Ren, Helen Wauck, Zeya Peng, Wai-Tat Fu, Lei Zhang, Shiliang Zuo
Publikováno v:
IUI
Research has demonstrated that spatial visualization skills are crucial for success in Science, technology, engineering, and mathematics (STEM) disciplines. With an increasing number of students entering STEM disciplines, the question of how to effec
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
In older to show the failure phenomena of breakdown spot caused by a small energy voltage for metal-insulator-metal (MIM) capacitors failure analysis in GaAs integrated circuit, different methods of de-golding technology was discussed in this paper.
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
Traditional epoxy filled with quartz sand cannot be used as plastic packaging materials of LED, as it is a kind of optoelectronic device. Its plastic packaging materials must be those with high light transmission rate such as epoxy and silicone. But
Publikováno v:
2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).
The trend of most electronic products is toward higher operating frequencies. Recently the microwave modules have been used worldwide step by step in high frequency application. In this paper, the reliability of bonding between substrate and metal ca