Zobrazeno 1 - 8
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pro vyhledávání: '"Zervas, Michail"'
Publikováno v:
KDD Undergraduate Consortium 2024
Split Learning has been recently introduced to facilitate applications where user data privacy is a requirement. However, it has not been thoroughly studied in the context of Privacy-Preserving Record Linkage, a problem in which the same real-world e
Externí odkaz:
http://arxiv.org/abs/2409.01088
Autor:
Karpov, Maxim, Guo, Hairun, Kordts, Arne, Brasch, Victor, Pfeiffer, Martin, Zervas, Michail, Geiselmann, Michael, Kippenberg, Tobias J.
Publikováno v:
Phys. Rev. Lett. 116, 103902 (2016)
The formation of temporal dissipative solitons in continuous wave laser driven microresonators enables the generation of coherent, broadband and spectrally smooth optical frequency combs as well as femtosecond pulses with compact form factor. Here we
Externí odkaz:
http://arxiv.org/abs/1506.08767
Akademický článek
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Autor:
Guo, Hairun, Karpov, Maxim, Kordts, Arne, Brasch, Victor, Pfeiffer, Martin H. P., Zervas, Michail, Geiselmann, Michael, Kippenberg, Tobias J.
Publikováno v:
2016 Conference on Lasers & Electro-Optics (CLEO); 2016, p1-2, 2p
In this letter we report on the fabrication and characterization of titanium dioxide (TiO2)-based resistive RAM (ReRAM) co-integration with 380 ìm-height Cu Through Silicon Via (TSV) arrays for programmable 3D interconnects. Nonvolatile resistive sw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::c92e0d29b5a9d7d028775c9f70ecaf74
https://infoscience.epfl.ch/record/167578
https://infoscience.epfl.ch/record/167578
In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in waf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::15f07d951e80a5ad5c8db7b8e7860a23
https://infoscience.epfl.ch/record/175216
https://infoscience.epfl.ch/record/175216