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pro vyhledávání: '"Zeev Wurman"'
Publikováno v:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
It is well recognized that dimensional scaling has reached its diminishing return phase and the industry is now looking to monolithic 3D to be the future technology driver. This was clearly voiced in the Qualcomm keynote at DAC 2014 and follow-on pre
Publikováno v:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
Monolithic 3D integration has generated considerable interest in recent years due it its inherent capability of supporting heterogeneous devices, and its rich vertical connectivity allowing for increased integration while reducing wire-length and pow
Publikováno v:
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
It is well recognized that dimensional scaling has reached its diminishing return phase and the industry is now looking to monolithic 3D to be the future technology driver. This was clearly voiced in the Qualcomm keynote at DAC 2014. This paper will
Autor:
Wurman, Zeev1, Evers, Williamson M.2,3
Publikováno v:
Education Week. 2/9/2011, Vol. 30 Issue 20, p28-29. 2p.
Publikováno v:
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S); 2014, p1-3, 3p
Publikováno v:
Education Week; 7/13/2011, Vol. 30 Issue 36, p40-42, 3p
Publikováno v:
1991, Proceedings International Test Conference; 1991, p01, 1p
Autor:
Chester E. Finn, Jr, Richard Sousa
The coming decade holds immense potential for dramatic improvement in U.S. education and in the achievement of American children and in this volume, members of the Hoover Institution's Koret Task Force on K - 12 Education examine both the potential g