Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Zechun Yu"'
Autor:
Christoph Friedrich Bayer, Martin Marz, Andreas Schletz, Zechun Yu, Dawei Zhao, Zheng Zhang, Weijian Zeng
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Silver-Silver direct bonding has been developed as an alternative interconnection technique for 3D power integration which can form high-strength and low-resistance Ag joints under solid-state conditions. However, the reliability and failure mechanis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fa77d164ed88ddda8a6d74e0674dbe8
https://doi.org/10.1109/estc48849.2020.9229753
https://doi.org/10.1109/estc48849.2020.9229753
Autor:
Andreas Schletz, Sebastian Letz, Christoph Friedrich Bayer, Shize Wang, Katsuaki Suganuma, Zechun Yu, Felix Hausler
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
In this study, Ag stress migration bonding (SMB) is demonstrated with various Ag film materials and bonding conditions. The main effects and interactions of various processing parameters such as bonding temperature, process time and applied pressure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ab1a38335ed0541f7ec65d8e055d5e8
https://doi.org/10.23919/icep.2019.8733496
https://doi.org/10.23919/icep.2019.8733496
Autor:
Stefan Zeltner, Gudrun Rattmann, Zechun Yu, Christoph Friedrich Bayer, Juergen Leib, Lothar Frey, Norman Boettcher, Tobias Erlbacher, Andreas Schletz
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Point of load (PoL) converters are emerging as common solution for industrial applications, telecommunications, server, and aerospace. In this work, a topology is designed for a single stage 48 V to 1 V PoL converter by using new gallium nitride (GaN
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::949ceab7afd0004c3831730d32ecec05
https://doi.org/10.1109/estc.2018.8546362
https://doi.org/10.1109/estc.2018.8546362
Autor:
Zechun Yu, Ying Zhao Tan, Christoph F. Bayer, Hubert Rauh, Andreas Schletz, Martin Marz, Olav Birlem
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cec2cca70aafbb2a784a71a6b00c2a0d
