Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Zechun Dou"'
Autor:
Mingyi Chen, Yusheng Shi, Lei Yang, Chunze Yan, Bo Song, Yongjiang Liu, Zechun Dou, Yanping Chen
Publikováno v:
Case Studies in Thermal Engineering, Vol 61, Iss , Pp 105095- (2024)
As a kind of triply periodic minimal surface (TPMS), the Gyroid-TPMS is utilized for fluid cooling system with good hydraulic and thermal performances. In this study, a special fin structure based on Gyroid-TPMS, referred to as the Gyroid-fin, is des
Externí odkaz:
https://doaj.org/article/ef7c44c94ef3408383d08f1d2d537338
Publikováno v:
IET Power Electronics, Vol 15, Iss 10, Pp 978-988 (2022)
Abstract With the rapid development of wide‐band gap semiconductor chip and package technologies, the voltage class of commercial silicon carbide (SiC) device is gradually improved. This paper concentrates on the latest 3.3‐kV full SiC‐based me
Externí odkaz:
https://doaj.org/article/93df57ba8c0f4e3581cda37f4288ba85
Publikováno v:
Energies, Vol 15, Iss 24, p 9651 (2022)
The bidirectional dc-dc converter is a critical component for extending the use of renewable energy and improving the efficiency of high-power electronic systems. This paper presents the analysis of the stray inductance of a commutation loop and the
Externí odkaz:
https://doaj.org/article/6049598232734f35a0b9ff9af4bda012
Publikováno v:
The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022) ISBN: 9789819906307
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5add1f2fb609d7a182d2ed07952193e
https://doi.org/10.1007/978-981-99-0631-4_66
https://doi.org/10.1007/978-981-99-0631-4_66
Publikováno v:
2022 Power System and Green Energy Conference (PSGEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9be4cee15084b734def3efea9d8c7cee
https://doi.org/10.1109/psgec54663.2022.9881132
https://doi.org/10.1109/psgec54663.2022.9881132
Publikováno v:
2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
Silver sinter technology is a very promising lead free interconnection method with high operating temperature, high thermal and electrical conductivity. In high power semiconductor modules the die attach material connects the die to the insulating su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e788e2cec8e902be756d15fa0f383d4
https://doi.org/10.1109/apec.2017.7931138
https://doi.org/10.1109/apec.2017.7931138