Zobrazeno 1 - 10
of 116
pro vyhledávání: '"Zbigniew Moser"'
Publikováno v:
Archives of Metallurgy and Materials, Vol 61, Iss 1, Pp 361-368 (2016)
The dilatometric and maximum bubble pressure methods were applied for the measurements of the density and surface tension of liquid (Ag-Sn)eut+Zn lead-free solders. The experiments were carried out in the temperature range from 515 to 1223 K for the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e7256bc9e5756ac34731af8f41bcb991
http://www.degruyter.com/view/j/amm.2016.61.issue-1/amm-2016-0067/amm-2016-0067.xml?format=INT
http://www.degruyter.com/view/j/amm.2016.61.issue-1/amm-2016-0067/amm-2016-0067.xml?format=INT
Publikováno v:
Intermetallics. 24:99-105
The solution calorimetric method was used for the determination of the formation enthalpy of Al 2 Fe and Al 5 Fe 2 intermetallic phases. The phases were prepared in a very pure Ar atmosphere by melting the calculated amounts of Al and Fe in alumina c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5ec87970d5fa10c556ffb75026c7622
https://doi.org/10.1016/j.intermet.2012.02.001
https://doi.org/10.1016/j.intermet.2012.02.001
Publikováno v:
Soldering & Surface Mount Technology. 24:4-11
PurposeThe purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. The practical aspect of the obtained results is the ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf0c55a8b9333db144884202be183cc3
https://doi.org/10.1108/09540911211198504
https://doi.org/10.1108/09540911211198504
Publikováno v:
International Journal of Thermophysics. 32:1210-1233
This work is aimed at comparing several methods for the measurement of physical properties for molten Sn and Sn–Ag alloys, namely, surface tension, density, and viscosity. The method used for viscosity in this work is the modified capillary method.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f85f9822d595d333e73358d11cbd9daa
https://doi.org/10.1007/s10765-011-1011-1
https://doi.org/10.1007/s10765-011-1011-1
Publikováno v:
Journal of Alloys and Compounds. 509:6131-6134
The technique of solution calorimetry with liquid Sn has been used for the determination of enthalpy of formation of intermetallic compounds from the Au–Sn system. The intermetallic phases were prepared and homogenized in a glow-box operated in hig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca200a12db534048461eddbdad732897
https://doi.org/10.1016/j.jallcom.2011.02.160
https://doi.org/10.1016/j.jallcom.2011.02.160
Publikováno v:
Archives of Metallurgy and Materials. 56:13-23
Modeling of the Thermodynamic Properties of Liquid Fe-Ni and Fe-Co Alloys From the Surface Tension DataRecently proposed method of modeling of thermodynamic properties of liquid binary alloys from their surface tension data is described. The method u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea67f5153abb7cd6ee32ff9a33b7fdd4
https://doi.org/10.2478/v10172-011-0002-3
https://doi.org/10.2478/v10172-011-0002-3
Autor:
Zbigniew Moser, Tomasz Gancarz, Janusz Pstruś, Janusz Sitek, M. Kościelski, Przemysław Fima, Władysław Gąsior, K. Bukat
Publikováno v:
Soldering & Surface Mount Technology. 23:22-29
PurposeThe purpose of this paper is to investigate the influence of In additions on the wetting properties of the Sn2.86Ag0.40Cu (in wt%) eutectic‐based alloys, on a copper substrate, in the presence of a flux. The main goal was to find correlation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::510506dbc3e00829b9ae691d83d19a4b
https://doi.org/10.1108/09540911111099677
https://doi.org/10.1108/09540911111099677
Publikováno v:
Soldering & Surface Mount Technology. 22:13-19
PurposeThe purpose of this paper is to investigate the influence of Bi additions on the wetting properties of SnZn7Bi alloys (Bi=1 and 3 per cent by mass) on a copper substrate and printed circuit boards (PCBs) with lead‐free finishes (SnCu, immers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6653ec39100fa75e9e8fcba40d8fd444
https://doi.org/10.1108/09540911011076844
https://doi.org/10.1108/09540911011076844
Publikováno v:
Soldering & Surface Mount Technology. 22:10-16
PurposeThe purpose of Part I of this paper is to investigate the influence of Bi additions on the surface tension, the interfacial tension, and the density of SnZn7Bi alloys (Bi=1 and 3 percent by mass) as a continuation of similar previous studies o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2374be770f26f696c39b9f2ad2f7a8e
https://doi.org/10.1108/09540911011054145
https://doi.org/10.1108/09540911011054145
Publikováno v:
International Journal of Thermophysics. 31:502-512
The electronic SURDAT database published in 2007 (available freely from the website www.imim.pl/english ) is being integrated with the NIST database (available freely from www.boulder.nist.gov/div853/lead_free/solders.html ) to provide a single sourc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::504e1dac88da72529382e2f519a49c39
https://doi.org/10.1007/s10765-010-0733-9
https://doi.org/10.1007/s10765-010-0733-9