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Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper describes the detection range of two failure site localization methods developed by the authors. One method, known as the absorbed current image (AEI) technique, is ideally suited for analyzing test element group interconnects on a huge sc
Autor:
Zane Marek, Alan S. Parkes
Publikováno v:
SPIE Proceedings.
Defect Scatter Analysis (DSA) provides a fast, accurate method for evaluating the random errors made by defect scanners when a wafer is loaded, aligned, scanned, and unloaded multiple times. The DSA tool includes a 200 mm or 300 mm wafer that has a s