Integration challenges of new materials and device architectures for IC applications.

Autor: Bich-Yen Nguyen, Thean, A., White, T., Vandooren, A., Sadaka, M., Mathew, L., Barr, A., Thomas, S., Zalava, M., Da Zhang, Eades, D., Zhong-Hai Shi, Schaeffer, J., Triyoso, D., Samavedam, S., Vartanian, V., Stephen, T., Goolsby, B., Zollner, S., Liu, R.

Publikováno v: 2004 International Conference on Integrated Circuit Design & Technology (IEEE Cat. No.04EX866); 2004, p237-243, 7p