Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Zafer DURSUNKAYA"'
Publikováno v:
Proceeding of 8th Thermal and Fluids Engineering Conference (TFEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::460dd8fb44f4ed04637657d43610b0e1
https://doi.org/10.1615/tfec2023.ahp.045873
https://doi.org/10.1615/tfec2023.ahp.045873
Publikováno v:
Volume: 42, Issue: 1 141-156
Isı Bilimi ve Tekniği Dergisi
Isı Bilimi ve Tekniği Dergisi
For the assessment of the thermal performance of heat pipes, a wide range of modeling is available in the literature, ranging from simple capillary limit analyses to comprehensive 3D models. While simplistic models may result in less accurate predict
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1a20c43a27fe859a053a38c1d7af454
https://hdl.handle.net/11693/111875
https://hdl.handle.net/11693/111875
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7711a488a80fe248f11cd5acff7b9f23
https://doi.org/10.2139/ssrn.4186480
https://doi.org/10.2139/ssrn.4186480
Autor:
Kaan Atak, Oyku Cosar, A. Cem Gozukara, Mustafa Ocak, Ahmet Ozdemir, Mustafa Karakoc, Zafer Dursunkaya, Barbaros Cetin
Publikováno v:
Proceeding of Proceedings of CONV-22: Int. Symp. on Convective Heat and Mass Transfer June 5 – 10, 2022, Turkey.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0d082089397e38a05163ea13a514873
https://doi.org/10.1615/ichmt.2022.conv22.520
https://doi.org/10.1615/ichmt.2022.conv22.520
The evaporation from a micropillar evaporator is a problem governed by various interfacial phenomena such as the capillarity-induced liquid flow, thin-film evaporation intensifying near the contact lines, and thermocapillarity-induced Marangoni flow.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0b9d126d5829163f476b47e63aeb657
Publikováno v:
International Communications in Heat and Mass Transfer
In this study, an enhanced heat pipe performance for grooved heat pipes has been demonstrated through capillary boosting with the introduction of the bifurcation of grooves. Wider grooves regularly branch to narrower grooves such that the total cross
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d840e003118f4fe0131b31679330e99
https://doi.org/10.1016/j.icheatmasstransfer.2022.106162
https://doi.org/10.1016/j.icheatmasstransfer.2022.106162
Publikováno v:
Physical Review Fluids
Droplet evaporation has been intensively investigated in past decades owing to its emerging applications in diverse fields of science and technology. Yet the role of transport mechanisms has been the subject of a heated debate, especially the presenc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d7aa39100ee64b14b60fd18f7693c946
https://hdl.handle.net/11693/77340
https://hdl.handle.net/11693/77340
Autor:
Gökay Gökçe, Zafer Dursunkaya
Publikováno v:
Advances in Heat Transfer and Thermal Engineering ISBN: 9789813347649
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2aa1fd365f3051b488be3c3a2c873388
https://doi.org/10.1007/978-981-33-4765-6_82
https://doi.org/10.1007/978-981-33-4765-6_82
Publikováno v:
E3S Web of Conferences, Vol 321, p 04013 (2021)
Droplet evaporation is a fundamental phenomenon encountered in diverse applications such as inkjet printing, DNA mapping, film coating, and electronics cooling. Modeling the evaporation process of a sessile droplet is complicated because of the coupl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b7b38f24d51c2283dac9f532ca89c575
https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/97/e3sconf_icchmt2021_04013.pdf
https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/97/e3sconf_icchmt2021_04013.pdf
Heat transfer via phase change is a major contributor to heat removal in numerous engineering applications. Thin films of liquid result in increased heat transfer due to a reduction of conduction resistance, in addition the pressure jump at the liqui
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::299cb8db0c66b64524258aa441354ed6
http://arxiv.org/abs/2004.07660
http://arxiv.org/abs/2004.07660