Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Zaeem Baig"'
Publikováno v:
Big Data Recommender Systems-Volume 1: Algorithms, Architectures, Big Data, Security and Trust ISBN: 9781785619755
A recommender system (RS) is software that provides suggestions to a user in decision making process. The decision making may be for commercial purposes, personalized applications or simple information retrieval. These systems have become an importan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c63f8e1200b073fc25a52cc1d918908b
https://doi.org/10.1049/pbpc035f_ch2
https://doi.org/10.1049/pbpc035f_ch2
Publikováno v:
IRPS
Thermal expansion mismatches pose significant challenges to the reliability of flip chip-Ball grid array (FC-BGA) package technology. Technology advancement for FC-BGA packages drives towards thinner substrates, smaller bump pitch and high flow under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f6612895eff6923a1af25fc23ad04e8
https://doi.org/10.1109/irps.2019.8720597
https://doi.org/10.1109/irps.2019.8720597
Autor:
Muhammad Usman Ul Haq, Hafiz Muhammad Umer Surkhail, Muhammad Mohsin Sheikh, Rabika Iqbal, Mirza Zaeem Baig
Publikováno v:
Proceedings of the 2nd International Conference on High Performance Compilation, Computing and Communications.
Industry-Academia collaboration is much necessary in order to provide benefit to this global village of technology. Indeed, there are many factors which are still needed to be considered in order to make use of computer science in IT industry. As an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1764d7fe57e628b2447b2e5592fd292e
https://doi.org/10.1145/3195612.3195620
https://doi.org/10.1145/3195612.3195620
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Replacing Silicon Dioxide (SiO 2 ) with low-k and ultralow-k (ULK), as a dielectric, in the Back-End-Of-Line (BEoL) has allowed the trend of miniaturization and convergence to continue. Although using low-k and ULK greatly increases the device perfor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b23de2eb5ce296674ec4efce8773b31c
https://doi.org/10.1109/itherm.2014.6892319
https://doi.org/10.1109/itherm.2014.6892319