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The traditional SerDes link simulation process begins with the extraction of printed circuit board (PCB) physical stripline and via models, followed by channel modeling and link simulation. We invert this simulation flow by first creating link perfor
Externí odkaz:
http://arxiv.org/abs/2304.01911
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:79-91
An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X band (8 to 12 GHz).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62610a1a670a5e6ecf9405cf068b38ef
https://doi.org/10.1109/tadvp.2002.1017689
https://doi.org/10.1109/tadvp.2002.1017689
Autor:
D.V. Weninger, P.J. Zucarelli, T.W. Keller, Mark E. Vickberg, Barry K. Gilbert, Zabinski Patrick J, David Moon Yee
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:215-224
In a collaborative project, the Mayo Foundation and Motorola have developed a fully functional miniaturized global positioning system (GPS) receiver using laminated multichip modules (MCM-L). This paper presents the system requirements, design constr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7885cd8515c6e092e00486021e88445f
https://doi.org/10.1109/96.486505
https://doi.org/10.1109/96.486505
Autor:
Zabinski Patrick J, R.J. Hakes, W.L. Walters, R.L. Thompson, B.M. Randall, Barry K. Gilbert, T.M. Schaefer, D.J. Schwab, L.O. Mielke
Publikováno v:
Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies.
During the past seven years, the Mayo Foundation has investigated the emerging electronic packaging approach referred to as Multichip Modules (MCMs), exploring a variety of MCM technologies' Our principal approach to evaluation of MCM technologies is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714db9cef2b88a3b0ad795a50aa59a3e
https://doi.org/10.1109/wptmt.1994.763516
https://doi.org/10.1109/wptmt.1994.763516
Akademický článek
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Akademický článek
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Autor:
Schwab, Daniel J., Randall, Barbara, Zabinski, Patrick J., Schaefer, Timothy M., Gilbert, Barry K.
Publikováno v:
IEEE Transactions on Advanced Packaging; Feb2002, Vol. 25 Issue 1, p79, 13p, 3 Black and White Photographs, 8 Diagrams, 1 Chart, 4 Graphs