Zobrazeno 1 - 10
of 254
pro vyhledávání: '"Z. Sauli"'
Publikováno v:
Active and Passive Electronic Components, Vol 2013 (2013)
This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of −3 dB, out-of-band rejection of −12 dB and 3 dB bandwidth of 1.0 GHz from 15 GHz
Externí odkaz:
https://doaj.org/article/5f9c4f245ec24645b1dfcd746ef13b15
Publikováno v:
Acta Physica Polonica A. 142:28-31
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26534be1f794d0be659b3d12e24f0cd7
https://doi.org/10.12693/aphyspola.142.28
https://doi.org/10.12693/aphyspola.142.28
Publikováno v:
ADVANCES IN MATERIAL SCIENCE AND MANUFACTURING ENGINEERING.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a2d755a0ffda4235c033d6e636a2a05
https://doi.org/10.1063/5.0117281
https://doi.org/10.1063/5.0117281
Autor:
Z. Sauli, Sazali Abdul Wahab, N. M. Nasri, Suriati Suhaimi, N. S. Ismail, Mukhzeer Mohamad Shahimin
Publikováno v:
AIP Conference Proceedings.
In the current investigation, natural tropical dyes extracted from Mulberry, Roselle and Oxalis Triangularis were used as natural dye sensitiser. Four different extraction solvents, namely acetone, ethanol, a mixture of acetone and ethanol (v/v 1:2)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe40092a470a803faef42225725d28d8
https://doi.org/10.1063/1.5142146
https://doi.org/10.1063/1.5142146
Akademický článek
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Publikováno v:
Journal of Physics: Conference Series. 2053:012008
Cu(In,Ga)Se2 (CIGSe) semiconductor is an efficient light absorber material for thin-film solar cell technology. The sequential evaporation of precursor solution, followed by the selenization process, is a promising non-vacuum and low-cost approach fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82581816e965c0c05d3129b5a142bd07
https://doi.org/10.1088/1742-6596/2053/1/012008
https://doi.org/10.1088/1742-6596/2053/1/012008
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
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Publikováno v:
AIP Conference Proceedings.
The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d44cd96a3658676a51ff51c73a073af
https://doi.org/10.1063/1.5002485
https://doi.org/10.1063/1.5002485
Autor:
S. Sakuntasathien, V. Retnasamy, J. B. Alcain, S. Kirtsaeng, Z. Sauli, Rajendaran Vairavan, P. Paitong, N. R. Ong, S. L. Lai
Publikováno v:
AIP Conference Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05ffeafcb4823e233318e7b416b43402
https://doi.org/10.1063/1.5002444
https://doi.org/10.1063/1.5002444
Autor:
Mukhzeer Mohamad Shahimin, K. Thangsi, V. Retnasamy, S. Kirtsaeng, N. R. Ong, S. Sakuntasathien, Z. Sauli, J. B. Alcain, Rajendaran Vairavan, S. L. Lai
Publikováno v:
AIP Conference Proceedings.
Metal core printed circuit board (MCPCB) is the vital component that provides electrical and thermal support to ensure the Light-emitting diodes (LEDs) performs well. Most of the MCPCB shapes are designed according to the LED application fixture and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e62a3dbef37a64894425e852daca993
https://doi.org/10.1063/1.5002449
https://doi.org/10.1063/1.5002449