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Our planar SOFC stacking technology uses unprofiled metallic interconnects (MIC) and thin cells of tape cast anode supported YSZ. The key element is the gas diffusion layer (GDL) between cell and MIC, which consists of so-called SOFConnex™. Using s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______185::a66a3f16fe3ac38001c3e902f923f4d7
https://infoscience.epfl.ch/record/143601
https://infoscience.epfl.ch/record/143601
Autor:
Bucheli, Olivier, Molinelli, Michele, Zähringer, Thomas, Thorn, Emily, Diethelm, Stefan, Wuillemin, Zacharie, Nakajo, Arata, Autissier, Nordahl, van Herle, Jan
Publikováno v:
ECS Transactions; May 2007, Vol. 7 Issue: 1