Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Yvonne Welz"'
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Electroless copper plating on various materials, including SAP-relevant substrates, was conducted by using a recently developed procedure involving palladium-free activation. The plating performance of this procedure was assessed by measuring the thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d390c999e67eff0863521374678711f
https://doi.org/10.1109/impact50485.2020.9268546
https://doi.org/10.1109/impact50485.2020.9268546
Autor:
Lutz Stamp, Julia Lehmann, Jan Knaup, Andre Beyer, Yvonne Welz, Sebastian Zarwell, Laurence J. Gregoriades, Stefan Kempa, Josef Gaida, Andreas Kirbs
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
A new activation process for electroless copper plating has been developed, which does not require the use of a palladium-based activation bath as typically employed in the plating industry. The activation bath of the new process described herein is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe28cc1e91aa51823c22b0ab3bdba11c
https://doi.org/10.1109/impact47228.2019.9024994
https://doi.org/10.1109/impact47228.2019.9024994