Zobrazeno 1 - 1
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pro vyhledávání: '"Yuya Minakata"'
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
In this paper, authors proposed an original sensor which can measure thermal fatigue life of electronic equipment. The measurement principle of the sensor is that the joint was damaged by the stress due to a mismatch of thermal expansion between two
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be81b93b0ba04ec8a3a2bfb74d322ba8
https://doi.org/10.1109/emap.2012.6507847
https://doi.org/10.1109/emap.2012.6507847
