Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Yuto Shigeno"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f26f320a057b5de0a37d4c7adf9d98bc
https://doi.org/10.23919/icep58572.2023.10129717
https://doi.org/10.23919/icep58572.2023.10129717
Autor:
Hidetoshi Inoue, Tsuyoshi Kamimura, Hirokazu Noma, Yuto Shigeno, Hisato Takahashi, Daisuke Hashimoto, Satomi Kawamoto, Tomohiro Ookubo, Haruyuki Yoshii
Publikováno v:
International Symposium on Microelectronics. 2017:000025-000028
This paper reports on the study of flexible epoxy resin which lowers modulus to minimize warpage while maintaining high filler content. Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level. LCM requires hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96e38bd618b9bdcd7d67c139f015483f
https://doi.org/10.4071/isom-2017-tp14_157
https://doi.org/10.4071/isom-2017-tp14_157