Výsledky vyhledávání

Effect of SiC formation temperature on improvement in thermal conductivity of electrodeposited SiC-coated diamond/Cu composite plating

Autor: Yuki Kamimoto, Takeshi Bessho, Yuto Naruse, Ichino Ryoichi, Jae-Hyeok Park, Takeshi Hagio

Publikováno v: Composite Interfaces. 29:256-273

Diamond/Cu composites are considered promising heat spreader materials; however, improving the interfacial adhesion between diamond and Cu is a challenge in manufacturing these composites. We focus...

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6cc95862dbbb1020e5fc1279a035c841
https://doi.org/10.1080/09276440.2021.1937856

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Electrodeposition of Ni-W/CNT Composite Plating and Its Potential as Coating for PEMFC Bipolar Plate

Autor: Tatsuya Wada, Yuto Naruse, Ichino Ryoichi, Jae-Hyeok Park, Takeshi Hagio, Yuki Kamimoto

Publikováno v: Coatings
Volume 10
Issue 11

In this study, Ni-W/carbon nanotube (CNT) composite platings are electrodeposited onto steel plate as a possible coating material for the polymer electrolyte membrane fuel cell (PEMFC) bipolar plate, which requires high corrosion resistance under aci

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::997bead41c91b1504c749b9c85dc60ac

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Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization

Autor: Yuki Kamimoto, Jae-Hyeok Park, Yuto Naruse, Ryoichi Ichino, Takeshi Bessho, Tkeshi Hagio

Publikováno v: Functional Materials Letters. 14(05):2151023

Compositing diamonds with high thermally conductive metals, such as copper, have attracted much attention in recent years. In this study, we prepared copper/diamond composites by electroplating and investigated the effect of the surface functionaliza

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f65f5144ab09820a059e1328f05edb8d
https://nagoya.repo.nii.ac.jp/records/2001949

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Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface

Autor: Takeshi Bessho, Takeshi Hagio, Yuki Kamimoto, Yuto Naruse, Yasuki Goto, Jae-Hyeok Park, Ryoichi Ichino

Publikováno v: Surface and Coatings Technology. 403:126322

Although copper is an effective heat-dissipation material, a material with a higher thermal conductivity is required to meet the demands of future electronics. Carbon materials (CMs) are of great interest owing to their excellent thermal conductiviti

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::67c0a10740e0a82de5ca48041ff4dee0
https://doi.org/10.1016/j.surfcoat.2020.126322

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Cu/Diamond Interfacial Adhesion Improved By Using Amino Group Modified Diamonds to Electroplating of Cu/Diamond Composite

Autor: Yuto Naruse

Publikováno v: ECS Meeting Abstracts. :3575-3575

Introduction Heat spreaders are used to ensure operation of electronic devices, such as smart phones, pads, LED and screen displays, by dissipating heat generated form integrated circuits. The ideal material working as heat spreaders should have high

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a4e34f23c00d9d6ad819de401f1ea4f6
https://doi.org/10.1149/ma2020-02683575mtgabs

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