Zobrazeno 1 - 10
of 151
pro vyhledávání: '"Yutaka Tsukada"'
Autor:
Hisashi Hisatomi, Kazuma Ohyashiki, Junko H. Ohyashiki, Kumi Nagao, Taichi Kanamaru, Hiroyuki Hirata, Nozomu Hibi, Yutaka Tsukada
Publikováno v:
Neoplasia: An International Journal for Oncology Research, Vol 5, Iss 3, Pp 193-197 (2003)
The human telomerase reverse transcriptase (hTERT) is an essential component of the holoenzyme complex that adds telomeric repeats to the ends of chromosomes. The hTERT transcript has been shown to have two deletion type alternative splicing sites. O
Externí odkaz:
https://doaj.org/article/f788c3ad226a493aa3bfc9ac2c56fce1
Publikováno v:
Journal of Clinical Laboratory Analysis
Background The intra‐individual reference range is generally narrower than the commonly used reference range. Consequently, close monitoring of changes in the laboratory test results of individuals based on the inter‐individual reference range re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ee747b4ca66c80806687a7b162d62a79
http://europepmc.org/articles/PMC7891514
http://europepmc.org/articles/PMC7891514
Publikováno v:
International Journal of Fatigue. 146:106132
This study discusses the creep-fatigue life prediction of eutectic Sn37Pb solder. Creep-fatigue lives were experimentally obtained at 313 K using fast-fast, slow-slow, slow-fast, fast-slow, and strain-hold waveforms. Conventional four creep-fatigue l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54e34eec2bea9e065584d108255d1ba6
https://doi.org/10.1016/j.ijfatigue.2020.106132
https://doi.org/10.1016/j.ijfatigue.2020.106132
Publikováno v:
International journal of oncology. 50(6)
It has been proposed that α-fetoprotein (AFP) is a new member of the intracellular signaling molecule family of the phosphoinositide 3-kinase (PI3K)/AKT signaling pathway via interaction with the phosphatase and tensin homolog (PTEN). In this study,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ae34ef26343dd5bee4c67ba5402ea337
https://pubmed.ncbi.nlm.nih.gov/28498467
https://pubmed.ncbi.nlm.nih.gov/28498467
Autor:
Yutaka Tsukada
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:163-168
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a2afd72ebfa9685a26a6056f40ca3f6
https://doi.org/10.5104/jiep.17.163
https://doi.org/10.5104/jiep.17.163
Autor:
Yutaka Tsukada
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 16:438-442
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9aa5e0af315ab73704fbdab650f57c42
https://doi.org/10.5104/jiep.16.438
https://doi.org/10.5104/jiep.16.438
Autor:
Yutaka Tsukada
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 16:335-340
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::407da2d8c14cb2391ca80d7bd57bd4d6
https://doi.org/10.5104/jiep.16.335
https://doi.org/10.5104/jiep.16.335
Publikováno v:
International Journal of Fatigue. 43:235-241
This paper describes a creep–fatigue life of Sn–8Zn–3Bi solder under multiaxial loading. A push–pull and a reversed torsion tests were carried out using seven types of strain waveforms, which are a fast–fast, a fast–slow, a slow–fast an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06b902f1b9b92365ae477dad41ae40b5
https://doi.org/10.1016/j.ijfatigue.2012.04.007
https://doi.org/10.1016/j.ijfatigue.2012.04.007
Publikováno v:
Journal of Photopolymer Science and Technology. 25:359-364
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c3957563191dffc1fb813e55d692376
https://doi.org/10.2494/photopolymer.25.359
https://doi.org/10.2494/photopolymer.25.359
Autor:
Soichi Kuritani, Kiju Lee, Kimihiro Yamanaka, Keun-Soo Kim, Katsuaki Suganuma, Yutaka Tsukada, Minoru Ueshima
Publikováno v:
Microelectronics Reliability. 51:2290-2297
The influence of the crystallographic orientation of Sn–3.0 wt%Ag–0.5 wt%Cu flip-chip joints and underfill on electromigration was investigated. The current density applied in our tests was 15 kA/cm2 at 160 °C. Various times to failure of the te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c35408a5935c169814825ac3462dc29c
https://doi.org/10.1016/j.microrel.2011.05.003
https://doi.org/10.1016/j.microrel.2011.05.003