Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Yutaka Kumano"'
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 26:290-292
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa277b06960977eb90c8ee7a6febc378
https://doi.org/10.5104/jiep.jiep-d-22-00119
https://doi.org/10.5104/jiep.jiep-d-22-00119
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:269-271
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a10e054741c87118a1028add4b4b856
https://doi.org/10.5104/jiep.jiep-d-21-00085
https://doi.org/10.5104/jiep.jiep-d-21-00085
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:188-192
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e123d07f2a70f67c65c9929ff1be1cc7
https://doi.org/10.5104/jiep.24.188
https://doi.org/10.5104/jiep.24.188
Autor:
Junichi Tachibana, Koichi Hirasawa, Noboru Takizawa, Keichi Hori, Fumitake Endo, Ikuo Sakurai, Masaru Tsumori, Ippei Yasutake, Takuya Shinoda, Ken Miyazaki, Akihiko Ookasaki, Kimihito Hatori, Keiichi Shinohara, Toshihiro Tsujimura, Toshifumi Yoshida, Hiroko Suzuki, Jun Eto, Chie Sugama, Toshihiro Miyoshi, Takaaki Umeda, Yutaka Kumano, Qun Yuan, Koji Nishi
Publikováno v:
The Proceedings of the Thermal Engineering Conference. 2019:0033
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d73aadbdad7898307734c52da57191f7
https://doi.org/10.1299/jsmeted.2019.0033
https://doi.org/10.1299/jsmeted.2019.0033
Autor:
Ikuo Sakurai, Yutaka Kumano, Takuya Shinoda, Keiichi Shinohara, Junichi Tachibana, Akihiko Ookasaki, Noboru Takizawa, Keichi Hori, Kimihito Hatori, Takaaki Umeda, Koichi Hirasawa, Toshifumi Yoshida, Toshihiro Miyoshi, Ippei Yasutake, Masaru Tsumori, Toshihiro Tsujimura, Jun Eto, Ken Miyazaki, Fumitake Endo, Chie Sugama, Hiroko Suzuki, Qun Yuan, Koji Nishi
Publikováno v:
The Proceedings of the Thermal Engineering Conference. 2019:0017
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6174016f49e2a98575bfd20278127df1
https://doi.org/10.1299/jsmeted.2019.0017
https://doi.org/10.1299/jsmeted.2019.0017
Publikováno v:
International Journal of Plasticity. 25:1759-1776
In-plane tension and compression experiments on copper alloy sheets (phosphor bronze) and 6000 series aluminum alloy sheets (AA6016-T4) were conducted using a specially designed testing apparatus. The apparatus is equipped with comb-type dies so that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cba74578e43bbb80d86b67eaf25cfce
https://doi.org/10.1016/j.ijplas.2009.01.004
https://doi.org/10.1016/j.ijplas.2009.01.004
Publikováno v:
Microelectronics Reliability. 41:525-530
A bare LSI chip mounted onto a flexible substrate is called chip-on-flex (COF). Companies and universities are desperately developing COF. In this paper, the development of COF using stud bump bonding (SBB) flip-chip technology will be introduced. So
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::867132372bcb358e07cfb8fbd17225e3
https://doi.org/10.1016/s0026-2714(00)00258-4
https://doi.org/10.1016/s0026-2714(00)00258-4
Publikováno v:
Journal of Electronic Packaging. 131
A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a1d2c64384132ea1811893e249414f0
https://doi.org/10.1115/1.3103947
https://doi.org/10.1115/1.3103947
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
As multilayered circuit boards in which semiconductors are embedded have been well reported, thermal management is becoming quite an important issue. In order to predict the junction temperature of an embedded semiconductor precisely, it is necessary
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb2a88dd38b96929197164a00abb349d
https://doi.org/10.1115/ipack2007-33372
https://doi.org/10.1115/ipack2007-33372
Publikováno v:
Scopus-Elsevier
The effect of the reorientation of 90° domains on the electric-field-induced strains was studied for tetragonal lead zirconate titanate (PZT) ceramics. An in situ X-ray diffraction (XRD) method was used to evaluate the 90° domain reorientation unde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f770e19ff65c5bff5dad183f649fdd9a
https://doi.org/10.1143/jjap.36.5970
https://doi.org/10.1143/jjap.36.5970