Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Yutaka Hayama"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 82, Iss 834, Pp 15-00392-15-00392 (2016)
Structural health monitoring has been used to confirm the durability evaluation and safety of a structure in which long-term use is required. Because the transmission loss of the optical fiber sensor is extremely small, it can measure the present sta
Externí odkaz:
https://doaj.org/article/ba5ddba9dbf347e6af693cccfeacc807
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 826, Pp 15-00072-15-00072 (2015)
Structural health monitoring is intended as a mechanism to ensure the operation and to evaluate the durability of the structure whose use is expected during a long time. It reduces life-cycle costs with ensuring the safety and the reliability of the
Externí odkaz:
https://doaj.org/article/f1b1fbbf744b4a97925629b438ec921a
Autor:
Masaaki Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Masaya Kato, Toru Ikeda, Yutaka Hayama, Seiya Hagihara, Noriyuki Miyazaki
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:260-268
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3607df46af7d2e5de1433bc89e84b802
https://doi.org/10.5104/jiep.jiep-d-21-00114
https://doi.org/10.5104/jiep.jiep-d-21-00114
Autor:
Seiya Hagihara, Yutaka Hayama, Masaaki Koganemaru, Noriyuki Miyazaki, Tomoki Sakaguchi, Nobuyuki Shishido
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:560-571
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b14eef893cc2c1b2b153a53bfe1541f3
https://doi.org/10.5104/jiep.jiep-d-21-00004
https://doi.org/10.5104/jiep.jiep-d-21-00004
Publikováno v:
The Proceedings of The Computational Mechanics Conference. :7-09
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bae9fd8569a863f3ea88532a54913d4c
https://doi.org/10.1299/jsmecmd.2022.35.7-09
https://doi.org/10.1299/jsmecmd.2022.35.7-09
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 23:173-191
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fa17e4bcbd12ef9ec52e2b4679fe97f
https://doi.org/10.5104/jiep.23.173
https://doi.org/10.5104/jiep.23.173
Publikováno v:
SiC Power Module Design: Performance, Robustness and Reliability ISBN: 9781785619076
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::350f7a064ae0ae00fc1e0af4c7bd6a8f
https://doi.org/10.1049/pbpo151e_ch8
https://doi.org/10.1049/pbpo151e_ch8
Publikováno v:
The Proceedings of The Computational Mechanics Conference. :7-08
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78f49d1534d8d1d66491ee77fdbbb965
https://doi.org/10.1299/jsmecmd.2022.35.7-08
https://doi.org/10.1299/jsmecmd.2022.35.7-08
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics. 7:1604-1614
Power modules are utilized for electric power control and play a key role in efficient energy conversion. A structural reliability problem of wire bonding, wire-liftoff, in power modules becomes important at high-temperature operation. Wire-liftoff i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efe07f99108f95b7376bc9a2e42d7e8b
https://doi.org/10.1109/jestpe.2019.2914244
https://doi.org/10.1109/jestpe.2019.2914244
Publikováno v:
Journal of Electronic Packaging. 143
This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which ind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82be7f26ccbce78c73f58a6dc25caf68
https://doi.org/10.1115/1.4048038
https://doi.org/10.1115/1.4048038