Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Yusuf Cinar"'
Publikováno v:
Communications, Vol 18, Iss 1, Pp 17-22 (2016)
WebRTC is an open-source platform for real-time communications over the web and has been experiencing widespread adoption in recent years. WebRTC clients employ the technique of time scaling of packets to cope with the impact of network jitter and/or
Externí odkaz:
https://doaj.org/article/7b4a82359a2046d481ff2e67e2a0f3ee
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Autor:
Eunho Oh, Junghoon Kim, Yusuf Cinar, Woosung Kim, Byungil Lee, Myungryul Jang, Namho Song, Sungki Lee, Jonggyu Park
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Publikováno v:
2023 IEEE International Reliability Physics Symposium (IRPS).
Publikováno v:
ACM Transactions on Multimedia Computing, Communications, and Applications. 17:1-20
This work studies the jitter buffer management algorithm for Voice over IP in WebRTC. In particular, it details the core concepts of WebRTC’s jitter buffer management. Furthermore, it investigates how jitter buffer management algorithm behaves unde
Publikováno v:
2020 31st Irish Signals and Systems Conference (ISSC).
Objective speech quality assessment techniques, which use the perceptual models to emulate the human listening perception, have seen several revisions in the recent years. This study investigates the evolution of POLQA and ViSQOL models and scrutinis
Publikováno v:
International Journal of Fatigue. 88:42-48
An investigation of the effect of dummy solder balls on the fatigue life of a solid-state drive (SSD) under vibration was studied. Finite element analysis and forced vibration experiments of an SSD were conducted to evaluate the fatigue life of an SS
Publikováno v:
Microelectronics Reliability. 53:2043-2051
This paper investigates the effect of solder pad size on the fatigue life of fine-pitch ball grid array (FBGA) solder joints in memory modules due to harmonic excitation by using a global–local modeling technique. Finite element analysis of a memor
Publikováno v:
5th ISCA/DEGA Workshop on Perceptual Quality of Systems (PQS 2016).
Publikováno v:
5th ISCA/DEGA Workshop on Perceptual Quality of Systems (PQS 2016).