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pro vyhledávání: '"Yusaku Asano"'
Autor:
Hisashi Ito, Tsuyoshi Sato, Matsuo Keiichiro, Kazuhito Higuchi, Yusaku Asano, Shimokawa Kazuo
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A novel wafer dicing method that can singulate silicon wafers into individual dies at once has been developed. Since this method relies on chemical reactions, we call it Chemical Dicing. Chemical Dicing has the advantages of high throughput, narrow d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f161b4910b2f3b90bd52467673f0869
https://doi.org/10.1109/ectc.2015.7159692
https://doi.org/10.1109/ectc.2015.7159692
