Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Yuri Uritsky"'
Autor:
Wei Liu, Christopher Lazik, C. R. Brundle, Yuri Uritsky, Malcolm J. Bevan, Paul F. Ma, Tang Wei, Bobek Sarah Michelle, Kulshreshtha Prashant Kumar, Venkatasubramanian Eswaranand, Ghazal Saheli
Publikováno v:
Journal of Electron Spectroscopy and Related Phenomena. 231:57-67
A brief introduction reviews the changes that have occurred in semiconductor wafer processing, which, coupled with developments in X ray Photoelectron Spectroscopy, XPS, instrumentation, have led to XPS becoming a primary materials analysis tool in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40c3db3351630b06da5eb3dece902a18
https://doi.org/10.1016/j.elspec.2018.03.007
https://doi.org/10.1016/j.elspec.2018.03.007
Autor:
Yuri Uritsky, Alberto Herrera-Gomez, A. Sanchez-Martinez, Milton Vázquez-Lepe, P.G. Mani-Gonzalez, Francisco S. Aguirre-Tostado, O. Ceballos-Sanchez, Robert M. Wallace, G. Conti
Publikováno v:
Journal of Electron Spectroscopy and Related Phenomena. 184:487-500
The angular dependence of the X-ray photoelectron spectroscopy (XPS) signal is influenced not only by the electron take-off angle, but also by instrument-related geometrical factors. The XPS signal is, in fact, integrated over the overlap between the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b68af4808031d2c366bdfc5173b6fe5
https://doi.org/10.1016/j.elspec.2011.08.002
https://doi.org/10.1016/j.elspec.2011.08.002
Publikováno v:
Scanning Microscopy 2010.
Ambient dynamic mode (tapping mode or intermittent-contact mode) AFM imaging has been used extensively for the characterization of the topography of nano structures. However, the results are beset with artifacts, because hard tapping of the AFM tip o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36b69f97da53c3bb225a578245ead23b
https://doi.org/10.1117/12.853948
https://doi.org/10.1117/12.853948
Autor:
Yuri Uritsky, Chris Ngai, Chorng-Ping Chang, Motoya Okazaki, Yufei Chen, Mani Thothadri, Paul V. Miller, Manjari Dutta, Deenesh Padhi, Wendy H. Yeh, Raymond Maas, Chris Lazik, Sen-Hou Ko, Stephan Sinkwitz, Martin Jay Seamons, Abraham Anapolsky
Publikováno v:
SPIE Proceedings.
The objective of this study was to examine the defect reduction effect of the wafer edge polishing step on the immersion lithography process. The experimental wafers were processed through a typical front end of line device manufacturing process and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98dca7331dce13eb97c78ea980795e05
https://doi.org/10.1117/12.773113
https://doi.org/10.1117/12.773113
Publikováno v:
Microscopy and Microanalysis. 13
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16a1129878e5df58bfc448ffc72e6f6a
https://doi.org/10.1017/s1431927607075113
https://doi.org/10.1017/s1431927607075113
Autor:
Yuri Uritsky, Abraham Anapolsky
Publikováno v:
Microscopy and Microanalysis. 11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49d86cce3550473fdc47fc36aa75682c
https://doi.org/10.1017/s143192760550895x
https://doi.org/10.1017/s143192760550895x
Publikováno v:
Microscopy and Microanalysis. 11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16c7a7274dbfba5204219de775afda19
https://doi.org/10.1017/s1431927605502617
https://doi.org/10.1017/s1431927605502617
Publikováno v:
AIP Conference Proceedings.
Surface roughness and grain morphology are among the critical parameters to be monitored during IC wafer processing, because, with the shrinking device critical dimensions, such parameters become more influential in device performance and manufacturi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3281021ebec274c903463f3ed117f03c
https://doi.org/10.1063/1.2062963
https://doi.org/10.1063/1.2062963
Autor:
Yuri Uritsky, G. Conti, Charles C. Wang, P. Mack, J. Wolstenholme, S. Hung, M. Foad, C. R. Brundle, H. Graoui
Publikováno v:
AIP Conference Proceedings.
The capabilities of Angle Resolved X‐Ray Photoelectron Spectroscopy, ARXPS, to provide depth‐resolved elemental and chemical state composition for ultra‐thin films are evaluated for two important front end material situations, Silicon Oxynitrid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::844c5ef70eeaa071b672cd27bc26b580
https://doi.org/10.1063/1.2062980
https://doi.org/10.1063/1.2062980
Publikováno v:
AIP Conference Proceedings.
Tantalum (Ta) metal has emerged as one of the leading materials of choice for diffusion barrier applications in Cu‐damascene interconnects. For successful implementation, the microstructure, the electrical property and the surface roughness of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fb0e8beec9d23512f7655901da7dda6
https://doi.org/10.1063/1.1622521
https://doi.org/10.1063/1.1622521