Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Yuri Piro"'
Publikováno v:
Journal of Electronic Materials. 52:1169-1176
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bc485fcdb587aaf91bf7e19eb18257f
https://doi.org/10.1007/s11664-022-10049-3
https://doi.org/10.1007/s11664-022-10049-3
Autor:
Yuri Piro, Christopher Aerias, Andrew Luce, Emily Lamport, Yibo Li, Susan Trulli, Alkim Akyurtlu
Publikováno v:
IMAPSource Proceedings. 2022
A UV curable dielectric ink composition, which enables adaptable and high-resolution direct ink writing, is presented. The UV curable dielectric ink composition is designed using non-hazardous, low cost, commercially available ingredients. The ink ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98fa1518867ae78e18560b3fa6135952
https://doi.org/10.4071/001c.74629
https://doi.org/10.4071/001c.74629
Publikováno v:
IMAPSource Proceedings. 2022
This paper presents the use of Additive Manufacturing (AM) in packaging applications. Specifically, the design, fabrication, and test of an AM packaged receiver phased array front-end will be shown. As part of this work, an LNA and phase shifter bare
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0d96cd8ea9b44299150705f1821c02e
https://doi.org/10.4071/001c.74545
https://doi.org/10.4071/001c.74545
Publikováno v:
IMAPSource Proceedings. 2022
Additive manufacturing (AM) for printed electronics (PE), though still in its infancy, has seen major growth in the past few years. AM techniques have several benefits over traditional manufacturing, namely the reduction of waste material and the inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48087f67eb55a3036bc149d9b3268726
https://doi.org/10.4071/001c.74620
https://doi.org/10.4071/001c.74620
Publikováno v:
2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c5af84b41273760d680670da42b63e6
https://doi.org/10.1109/ap-s/usnc-ursi47032.2022.9886376
https://doi.org/10.1109/ap-s/usnc-ursi47032.2022.9886376
Publikováno v:
2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e86e5cac5f010d06eba81a562ecec32b
https://doi.org/10.1109/ap-s/usnc-ursi47032.2022.9886701
https://doi.org/10.1109/ap-s/usnc-ursi47032.2022.9886701
Autor:
Jotham Kasule, Shokat Ganjeheizadeh Rohani, Mark Pothier, Yuri Piro, Alkim Akyurtlu, Craig Armiento
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34bf0cb5d261d7003b3548705c3b9c7f
https://doi.org/10.1109/ectc51906.2022.00345
https://doi.org/10.1109/ectc51906.2022.00345
Publikováno v:
SSRN Electronic Journal.
In this article, we report the development of a new method for the 3D printing of dielectrics. An aerosol-jet printer is used to deposit overlapping layers of photopolymer material under ultraviolet floodlight in the assembly of ramping microstructur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f75332a39f18f8899098f0892128477d
https://doi.org/10.2139/ssrn.4062354
https://doi.org/10.2139/ssrn.4062354
Autor:
Alkim Akyurtlu, Yuri Piro, Andrew M. Luce, Mahdi Haghzadeh, Guinevere Strack, Edward Kingsley, Craig Armiento, Cameron Hardie, Margaret J. Sobkowicz, Oshadha Ranasingha
Publikováno v:
Flexible and Printed Electronics. 5:045007
Here, we report a previously un-reported printed electronics/additive manufacturing (AM) approach to fabricate conductive/resistive features on novel insulating silver–barium strontium titanate (Ag–BST) printed composite films. Ag–BST composite
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5ba86a265a9d899ce70eae1ea1b5a4d
https://doi.org/10.1088/2058-8585/abcc78
https://doi.org/10.1088/2058-8585/abcc78
Publikováno v:
Advancing Microelectronics; Jul/Aug2022, Vol. 49 Issue 4, p22-25, 4p