Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Yuri E. Solomentsev"'
Publikováno v:
Journal of Colloid and Interface Science. 232:111-120
During the electrolytic evolution of oxygen bubbles forming on a vertically oriented transparent tin oxide electrode, bubbles were found to be mutually attractive. The mechanism of the aggregation had never been explained satisfactorily until Guelche
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ac51c36c4cfaa26b7019350ff4843881
https://doi.org/10.1006/jcis.2000.7210
https://doi.org/10.1006/jcis.2000.7210
Publikováno v:
Journal of The Electrochemical Society. 145:1848-1855
Oxygen bubbles evolved in potassium hydroxide solution during electrolysis have been reported to be mutually attractive. A model based on thermocapillary flow and migration can explain the effect. A temperature gradient directed perpendicular to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2def73858dec23f509aa94cf54abeb2b
https://doi.org/10.1149/1.1838566
https://doi.org/10.1149/1.1838566
Autor:
Yuri E. Solomentsev, John L. Anderson
Publikováno v:
Industrial & Engineering Chemistry Research. 34:3231-3238
The velocity of a uniformly charged spheroid in a spatially varying electric field, E∞(x), is determined. The electrical double layer at the particle's surface is assumed to be very thin relative to the size of the particle. The electric field prod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0872256f33b9174eb60a3cab31f906b1
https://doi.org/10.1021/ie00037a008
https://doi.org/10.1021/ie00037a008
Autor:
Victor Starov, Yuri E. Solomentsev
Publikováno v:
Journal of Colloid and Interface Science. 158:159-165
The electroosmotic flow in a straight cylindrical capillary with a porous gel layer on its wall is considered, taking into account an ion's interaction with the porous layer. It is shown theoretically that this interaction substantially modifies elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0c7fa95094c8a4941db27fbb765c2da6
https://doi.org/10.1006/jcis.1993.1242
https://doi.org/10.1006/jcis.1993.1242
Publikováno v:
2006 IEEE International Reliability Physics Symposium Proceedings.
We have discovered a novel failure mode in M2-M2 intralevel bias temperature stress (BTS) and ramp voltage breakdown (RVB) testing, in which the failure is mediated by shorting between the M2 and M1 metal layers. It has been observed in two copper/ul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30e58154553b3d9cc1d53f7f0d9e1c9e
https://doi.org/10.1109/relphy.2006.251326
https://doi.org/10.1109/relphy.2006.251326
Autor:
John L. Anderson, Yuri E. Solomentsev
Publikováno v:
Physics of Fluids. 8:1119-1121
The velocity field about a sphere of radius a rotating in a Brinkman fluid is derived and the hydrodynamic torque is calculated. The effect of the Darcy permeability (k) on the torque is O(a2/k), compared to O(a/k1/2) for the translational drag. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14743f3f2c69c7aad5130bc6b404e49d
https://doi.org/10.1063/1.868890
https://doi.org/10.1063/1.868890
Autor:
C. Wang, J. Pellerin, A. Singhal, M. Aminpur, R. Chowdhury, Russell L. Carter, C. Prindle, T. Ryan, Kurt H. Junker, J. Iacoponi, Da Zhang, B. Melnick, L. Svedberg, N. Grove, E.J. Weitzman, M.-F. Ng, B. Brennan, J. Linville, T. Lii, Charles Fredrick King, Cindy Kay Goldberg, V. Wang, Jeremy L. Martin, P. Ventzek, J. Mueller, M. Kiene, J. Werking, M. Woo, S. Usmani, A. Guvenilir, Kirk J. Strozewski, Yuri E. Solomentsev, Kathleen C. Yu, Tab A. Stephens, Dean J. Denning, Stanley M. Filipiak, F. Huang, Janos Farkas, David Smith, Narayanan C. Ramani, P. Crabtree, T. Sparks, B. Wilson, John C. Flake, I. Shahvandi, Kevin E. Cooper, S. Kim, M. Olivares, B. Eggenstein
Publikováno v:
Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).
The integration challenges of a low-k dielectric (k < 3) to form multi-level Cu interconnects for the next generation 0.1 /spl mu/m CMOS technology are presented. Process improvements to overcome these challenges are highlighted which include etchfro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b62c9efc1f66fc1edd1c412d7acdaf8
https://doi.org/10.1109/iitc.2002.1014870
https://doi.org/10.1109/iitc.2002.1014870
Publikováno v:
AIP Conference Proceedings.
Thermocapillary flow near adjacent bubbles on heated surfaces explains bubble aggregation on a hot surface. The bubbles pump fluid away from the heated surface; this action draws liquid near the wall laterally toward the bubble. Bubbles mutually entr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::374fadd255b67101a6a7b0220fa0313f
https://doi.org/10.1063/1.1302500
https://doi.org/10.1063/1.1302500
Publikováno v:
Journal of The Electrochemical Society. 150:C195
Wafer-scale profile evolution of electrochemically deposited copper films is experimentally studied and compared with theoretical predictions. The effects of ohmic potential drop, electrochemical current-voltage behavior at the metal/electrolyte inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3696bd8ef3b7987924b66280585bef9
https://doi.org/10.1149/1.1554723
https://doi.org/10.1149/1.1554723