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pro vyhledávání: '"Yung-Tsan Yu"'
Autor:
Yung-Tsan Yu, Lei-Jun Tang, Hong-Meng Ho, Yue-Jia Zhang, Chun-Shu Huang, Wei Koh, Kay-Soon Goh
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
There is a growing interest in copper wire bonding for IC interconnection due to the cost savings and better material properties. Recently, palladium-coated copper (Pd-Cu) wire has emerged as the preferred choice over bare Cu wire in fine wire diamet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ca9fd2abf0eb279d912f13b276e407d
https://doi.org/10.1109/ectc.2011.5898736
https://doi.org/10.1109/ectc.2011.5898736
Autor:
Lei-Jun Tang, Hong-Meng Ho, Wei Koh, Yue-Jia Zhang, Kay-Soon Goh, Chun-Shu Huang, Yung-Tsan Yu
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1673-1678, 6p